Thermoelectric Cooler Module Structure

Abstract

The present invention provides a thermoelectric cooler module structure comprising a first conductive pad, a second conductive pad, and a third conductive pad, wherein a first thermoelectric pellet and a second thermoelectric pellet are formed on said first conductive pad separately to connect said first conductive pad and said second conductive pad, said first conductive pad and said third conductive pad, and an isolation layer formed between said first thermoelectric pellet and said second thermoelectric pellet on said first conductive pad.

Description

BACKGROUND OF THE PRESENT INVENTION[0001]1. Field of Invention[0002]The invention relates to a thermoelectric cooling module structure, and more particularly to a thermoelectric cooler module structure for automation and without a need of handwork in fabrication process.[0003]2. Description of Related Arts[0004]Referring to the FIGS. 1A, 1B, and 1C, they illustrate the conventional structure of thermoelectric cooler modules. The solder (not shown) is used to bind the conductive pad 110 and thermoelectric pellets 140, 150 mechanically and electrically. The conductive pad 110 is a piece of metal with good electric and thermal conductivity usually made of but not limited to copper. The thermoelectric pellets 140, 150 are usually but not limited to Bi and Te based alloy with high Seebeck coefficient, high electric conductivity, and low thermal conductivity. Two types of thermoelectric pellets, one with positive Seebeck coefficient and called P type 140 and the other with negative Seebec...

AI Technical Summary

Benefits of technology

[0007]An object of the present invention is to provide a thermoelectric cooler module structure to improve the efficiency of the fabrication process.

[0008]Another object of the present invention is to save cost of fabrication for no need of the modes to manually place thermoelectric pellets.

Problems solved by technology

Automatic placing the thermoelectric pellets 140, 150 is difficult due to the small size of the holes in the mode.

There is little tolerance for placing accuracy, and any placing mistake will screw up the module fabrication.

Therefore, it has to be done by hand-picking pellets into holes one by one, and is a labor-intensive work, since there are tens to hundreds of thermoelectric pellets and conductive pad connections to form a thermoelectric cooler module.

For the conventional structure, it is almost impossible to have a totally automatic fabrication process due to the assembly difficulty.

Labor-intensive process can be expensive and not efficient for mass production.

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