Laminates joined by polyurethane hot-melt adhesive and process for bonding plasticizer-containing plastics

a technology of hot-melt adhesive and laminate, which is applied in the field of laminates, can solve the problems of reducing the mechanical properties of the adhesive caused by hot/humid or alternating storage, and achieve the effect of reducing the disadvantages of plasticizer-containing plastic bonding, reducing the disadvantages, and gradual loss of adhesion

Inactive Publication Date: 2008-11-13
SIKA TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0006]It is an object of the present invention, therefore, to eliminate or to reduce the disadvantages of the bonding of...

Problems solved by technology

Further, it has surprisingly emerged that the drop in the mechanical properti...

Method used

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  • Laminates joined by polyurethane hot-melt adhesive and process for bonding plasticizer-containing plastics
  • Laminates joined by polyurethane hot-melt adhesive and process for bonding plasticizer-containing plastics
  • Laminates joined by polyurethane hot-melt adhesive and process for bonding plasticizer-containing plastics

Examples

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examples

[0253]Preparation of aldimines

[0254]Aldimine A-1

[0255]A round-bottomed flask was charged under a nitrogen atmosphere with 74.3 g (0.26 mol) of distilled 2,2-dimethyl-3-lauroyloxypropanal. With vigorous stirring, from a dropping funnel, 30.0 g (0.25 mol N) of polyetherdiamine (polyoxypropylenediamine having an average molecular weight of about 240 g / mol; Jeffamine® D-230, Huntsman; amine content 8.29 mmol N / g) were added slowly, in the course of which the mixture underwent heating and increasing clouding. Thereafter the volatile constituents were removed under vacuum (10 mbar, 80° C.). Yield: 99.5 g of a clear, pale yellow oil having an amine content of 2.50 mmol N / g.

[0256]Aldimine A-2

[0257]A round-bottomed flask was charged under a nitrogen atmosphere with 28.06 g (0.099 mol) of distilled 2,2-dimethyl-3-lauroyloxypropanal. With vigorous stirring, from a dropping funnel, 10.00 g (0.095 mol) of 2-(2-aminoethoxy)ethanol (Diglycolamine® Agent; Huntsman) were added over the course of 3 m...

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Abstract

The present invention relates to laminates of a plasticizer-containing plastic, obtained by bonding by means of a moisture-reactive hot-melt adhesive which comprises at least one aldimine and at least one polyurethane polymer which contains isocyanate groups and is solid at room temperature. The bonded assembly is notable for improved adhesive, particularly following heat/moisture storage or alternating storage. Preferred embodiments of such laminates are bonded films or film-laminated supports, the film preferably being a pPVC film.

Description

FIELD OF THE INVENTION [0001]The invention relates to the field of hot-melt adhesives containing isocyanate groups and to the bonding of plasticizer-containing plastics, more particularly of films.BACKGROUND ART [0002]Hot-melt adhesives (hot melts) are adhesives which are based on thermoplastic polymers. These polymers are solid at room temperature but soften on heating to become viscous liquids and can therefore be applied in the form of a melt. In contrast to what are referred to as warm-melt adhesives (warm melts), which have a pastelike consistency and are applied at slightly elevated temperatures, typically in the range from 40 to 80° C., the hot-melt adhesives are applied at temperatures of 80° C. or above, typically 85° C. or above. On cooling to room temperature they solidify and at the same time develop the bond strength. Conventional hot-melt adhesives are non-reactive adhesives. On heating they soften or melt again, so making them unsuited to use at elevated temperature. ...

Claims

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Application Information

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IPC IPC(8): B32B7/12B32B27/06B32B27/40C09J4/00
CPCB29C66/026B29C65/484B29K2027/06B29K2055/02B29K2069/00B29K2105/0038B29L2009/00B32B7/12B32B27/04C08G18/12C08G18/4202C08G18/503C08G2170/20B29C66/45B29C65/489B29C65/485B29C65/4815B29C65/527B29C65/522B29C65/524B29C65/526C08G18/3296C08G18/50B29C65/00B29C66/721B29C65/1412B29C65/1464B29C66/73921B29C66/73941B29C66/71B29C66/723B29C66/1122Y10T428/31551Y10T428/3158Y10T428/31507Y10T428/31583B29C65/4835B29C65/48B29C65/50
Inventor PASCHKOWSKI, KAISCHEIDLER, DOREENBURCKHARDT, URSSLONGO, MARIO
Owner SIKA TECH AG
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