Semiconductor package and method for manufacturing the same

a technology of semiconductors and packaging, applied in the field of semiconductor packaging, can solve the problems of thin-type substrate warping and serious warping of bga packages having thin-type substrates during subsequent thermal processes, and achieve the effect of decreasing the processing step of semiconductor packages
US20090289338A1Inactive Publication Date: 2009-11-26ADVANCED SEMICON ENG INC
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
ADVANCED SEMICON ENG INC
Publication Date
2009-11-26
Estimated Expiration
Not applicable · inactive patent

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Abstract

A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier, and is mounted on the carrier. The encapsulant is adapted to seal the chip and the stiffener.
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Description

CROSS REFERENCE TO RELATED APPLICATION

[0001] This application claims the priority benefit of Taiwan Patent Application Serial Number 097119025, filed on May 23, 2008, the full disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention generally relates to a package, and more particularly to a semiconductor package, wherein the mechanical robustness of a stiffener that can prevent a carrier (e.g. substrate) from warping during subsequent thermal processes. Also, the stiffener can be directly mounted on the carrier by the attaching force of an encapsulant. It is not necessary that the stiffener is attached on the carrier by an extra adhesive, thereby decreasing the processing step of the semiconductor package.

[0004] 2. Description of the Related Art

[0005] Due to chips having high performance are required, a chip package having a thin type substrate is increasingly put in use. For example, the chip package ...

Claims

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