Method of manufacturing multilayer ceramic substrate
a technology of ceramic substrates and ceramic layers, applied in the direction of fixed capacitors, packaging, hollow inflatable balls, etc., can solve the problems of low deformation and displacement of interlayer circuits, etc., and achieve the effect of improving the location precision of interlayer circuits
Inactive Publication Date: 2010-04-29
SAMSUNG ELECTRO MECHANICS CO LTD
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Benefits of technology
The present invention provides a method of manufacturing a multilayer ceramic substrate with improved location precision of interlayer circuits and enhanced bonding force between ceramic blocks. This is achieved by firing multiple ceramic blocks, bonding them using a binder layer or a bonding ceramic green sheet containing the glass component, and laminating them together. The bonding process involves melting the glass component of the bonding ceramic green sheet by heating the ceramic blocks. The thickness of each ceramic block is 2 mm or less. The method also allows for the use of second bonding ceramic green sheets containing a glass component between the ceramic blocks, which can be connected with interlayer circuits. The second bonding ceramic green sheet may further include a binder layer.
Problems solved by technology
However, the interlayer circuits have low location precision because they are displaced or deformed as the ceramic laminate shrinks when fired.
However, despite the constraining layer, the ceramic laminate, having a thickness of 5 mm or greater, still shrinks in the plane direction, causing the interlayer circuits to become deformed and displaced.
Method used
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Embodiment Construction
[0027]Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[0028]FIGS. 1A and 1B are views for explaining a method of manufacturing a multilayer ceramic substrate, according to an exemplary embodiment of the present invention. Referring to FIG. 1A, a plurality of ceramic blocks 100, 200, 300, 400 and 500 are manufactured. Each of the ceramic blocks 100, 200, 300, 400 and 500 includes a ceramic laminate and a first bonding ceramic green sheet. Hereinafter, the ceramic blocks 100, 200,300, 400 and 500 are also referred to as first to fifth ceramic blocks 100, 200, 300, 400 and 500, respectively.
[0029]Specifically, the first ceramic block 100 includes a ceramic laminate 110 and a first bonding ceramic green sheet 120. In this case, the ceramic laminate 110 may include a plurality of ceramic green sheets. A first bonding ceramic green sheet 120 is disposed on one of first and second surfaces of the ceramic laminate 11...
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Abstract
Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the priority of Korean Patent Application No. 2008-0106189 filed on Oct. 28, 2008, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a method of manufacturing a multilayer ceramic substrate, and more particularly, to a method of manufacturing a multilayer ceramic substrate, which includes the bonding of a plurality of ceramic blocks.[0004]2. Description of the Related Art[0005]In general, semiconductor devices are subject to a large number of processes in order to perform their operations as one complete semiconductor package. Specifically, these processes may include semiconductor wafer production, fabrication (FAB) and assembly.[0006]A plurality of semiconductor devices are formed on a wafer by FAB, and then electrical die sorting (EDS) is performed on the pluralit...
Claims
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IPC IPC(8): C03B29/00
CPCB32B18/00Y10T156/1089C04B2235/36C04B2237/10C04B2237/562C04B2237/62C04B2237/704H01G4/105H01G4/232H01G4/30H05K3/4629H05K2201/0195H05K2203/061C04B35/634C04B2237/341C04B2237/565C04B2237/595C04B2237/68C04B2237/708C04B2237/72C04B37/005H05K3/46
Inventor CHOI, YONG SEOKJEONG, SEUNG GYOPARK, EUN TAEHONG, KI PYOLYOO, SOO HYUN
Owner SAMSUNG ELECTRO MECHANICS CO LTD