Wire bonding apparatus, record medium storing bonding control program , and bonding method
a control program and wire bonding technology, applied in the direction of soldering apparatus, manufacturing tools,auxillary welding devices, etc., can solve the problems of improper formation, inability to recover from such errors, and inability to continue bonding
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first embodiment
[0153]The wire bonding apparatus 10 of the First Embodiment of the present invention is shown in FIG. 1. The wire bonding apparatus 10 comprises, instead of the position detection camera 128 of the conventional wire bonding apparatus 100, an imaging device 28 that is capable of not only detecting a position but also imaging a work; and the wire bonding apparatus 10 further includes two clampers, namely a first clamper 17a and a second clamper 17b, that are opened and closed, respectively, by a clamper operating device 27. This clamper operating device is disclosed in the allowed claims of U.S. Pat. No. 5,323,948 (The disclosure of the claims of this patent is incorporated by reference). The clamper operating device operates a pair of (two) clamping arms of each one of the first and second clampers, each holding a bonding wire between the clamping arms; and at least one of the clamping arms is operated (opened and closed) by electric strain effect or magnetic strain effect of a piezo...
second embodiment
[0173]In the process by the non-bonding recovery program 74 for pad of the above-described First Embodiment, after the bonding to lead 4 (second bonding point), the tail wire 8 is formed well; and no discharge anomaly occurs with the ball formation device 26. However, when a non-bonding error occurs at the pad 3 (first bonding point) in the wire bonding apparatus 10, there are cases that the ball is not formed into a prescribed shape by re-discharge because the shape of the tip end of the wire after non-bonding is also anomalous. In view of this, the Second Embodiment of the present invention is a processing executed by the non-bonding recovery program 74 for pad that includes the processing executed by the discharge anomaly recovery program 79. In the description below, the same symbols are used for the steps that are the same as for the processing executed by the non-bonding recovery program 74 for pad described above, and no further description will be given to them.[0174](1) In ...
third embodiment
[0192]Next, the Third Embodiment of the present invention that is for a recovery processing when a no-tail is detected at the lead 4 (second bonding point) will be described. In the following description, the same symbols are used for portions that are the same as those in the non-bonding recovery processing for pad, recovery processing during discharge, and the processing executed by the tail re-payout program 75 that are described above, and no further description will be given thereto.[0193](1) As in the above-described processing executed by the non-bonding recovery program 74 for pad, when no non-bonding is detected for the pad 3 (first bonding point) by executing the electrical non-bonding detection program by signals from the electrical conduction state acquisition device 22 when bonding to the pad 3 (first bonding point), bonding to the pad 3 (first bonding point) is deemed to have been done well and bonding is performed to the lead 4 (second bonding point). After bonding to...
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