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Composite alloy bonding wire and manufacturing method thereof

Inactive Publication Date: 2010-09-23
LEE JUN DER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]The subject of this invention is to provide a low cost composite alloy bonding wire made of silver and Palladium, capable of having performance as good as a pure Au bonding wire.
[0011]The composite alloy bonding wire is capable of having performance as good as a pure Au bonding wire and decreasing the manufacturing cost.

Problems solved by technology

However, pure Au bonding wire inevitably leads to high cost.

Method used

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  • Composite alloy bonding wire and manufacturing method thereof
  • Composite alloy bonding wire and manufacturing method thereof
  • Composite alloy bonding wire and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

embodiment 1

[0024]A primary material of Ag is provided and is melted in a vacuum melting furnace. Then, specific amount of a secondary metal material of Pd is added into the vacuum melting furnace, and is co-melted with the primary material in the vacuum melting furnace to obtain a Ag—Pd alloy solution. The Ag—Pd alloy solution consists of: 99.99 wt. % Ag and 0.001 wt. % Pd.

[0025]Continuous casting and drawing processes are performed on the Ag—Pd alloy solution to obtain a Ag—Pd alloy wire with a diameter of 4 mm. The Ag—Pd alloy wire is rewired by a reeling machine and then composition analysis is performed on the Ag—Pd alloy wire to check if the obtained composition meets the requirement.

[0026]A drawing process is performed on the Ag—Pd alloy wire; the obtained Ag—Pd alloy wire with a diameter of 4 mm is drawn by a first thick drawing machine to obtain a Ag—Pd alloy wire with a diameter of 3 mm. The Ag—Pd alloy wire with a diameter of 3 mm is drawn by a second thick drawing machine to obtain ...

embodiment 2

[0028]A primary material of Ag is provided and is melted in a vacuum melting furnace. Then, specific amount of a secondary metal material of Pd is added into the vacuum melting furnace, and is co-melted with the primary material in the vacuum melting furnace to obtain a Ag—Pd alloy solution. The Ag—Pd alloy solution consists of: 95.00 wt. % Ag and 5.00 wt. % Pd.

[0029]Continuous casting and drawing processes are performed on the Ag—Pd alloy solution to obtain a Ag—Pd alloy wire with a diameter of 6 mm. The Ag—Pd alloy wire is rewired by a reeling machine and then composition analysis is performed on the Ag—Pd alloy wire to check if the obtained composition meets the requirement.

[0030]A drawing process is performed on the Ag—Pd alloy wire; the obtained Ag—Pd alloy wire with a diameter of 6 mm is drawn by a first thick drawing machine to obtain a Ag—Pd alloy wire with a diameter of 3 mm. The Ag—Pd alloy wire with a diameter of 3 mm is drawn by a second thick drawing machine to obtain a...

embodiment 3

[0032]A primary material of Ag is provided and is melted in a vacuum melting furnace. Then, specific amount of a secondary metal material of Pd is added into the vacuum melting furnace, and is co-melted with the primary material in the vacuum melting furnace to obtain a Ag—Pd alloy solution. The Ag—Pd alloy solution consists of: 90.00 wt. % Ag and 10.00 wt. % Pd.

[0033]Continuous casting and drawing processes are performed on the Ag—Pd solution to obtain a Ag—Pd alloy wire with a diameter of 8 mm. The Ag—Pd alloy wire is rewired by a reeling machine and then composition analysis is performed on the Ag—Pd alloy wire to check if the obtained composition meets the requirement.

[0034]A drawing process is performed on the Ag—Pd alloy wire; the obtained Ag—Pd alloy wire with a diameter of 8 mm is drawn by a first thick drawing machine to obtain a Ag—Pd alloy wire with a diameter of 2 mm. The Ag—Pd alloy wire with a diameter of 2 mm is drawn by a second thick drawing machine to obtain a Ag—P...

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Abstract

A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain a Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain a Ag—Pd alloy bonding wire with a predetermined diameter.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention generally relates to a bonding wire used as a packaging wire, in particular, to a bonding wire used in semiconductor packaging process.[0003]2. Description of Related Art[0004]In semiconductor device packaging processes for IC, LED, SAW, a wire bonding process is often performed to electrically connect the chip to the substrate by bonding wire, which used as a signal and electrical current transmitting medium between the chip and the substrate.[0005]The primary characteristics of a bonding wire, such as breaking load, elongation, loop, melting point, and bondability with IC chips are dependent on the materials used as the bonding wire. The performance of the packaged semiconductor device is influenced by the characteristics of the bonding wire. According to different types of chip and substrate, the adapted bonding wire has different specification.[0006]The conventional bonding wires are usually ma...

Claims

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Application Information

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IPC IPC(8): C22C5/06B21C1/00
CPCB21C1/003B21C37/047C22F1/14C22C5/06B23K35/3006H01L24/43H01L24/45H01L2224/45139H01L2224/43848H01L2224/43986H01L2224/45015H01L2224/45144H01L2924/14H01L2924/12041H01L2224/437H01L2924/00011H01L2924/01046H01L2924/013H01L2924/01201H01L2924/01202H01L2924/01203H01L2924/01204H01L2224/4321H01L2924/00015H01L2924/20755H01L2924/20756H01L2924/20757H01L2924/20758H01L2924/20759H01L2924/2076H01L2924/00014H01L2924/01049H01L2924/01005
Inventor LEE, JUN-DER
Owner LEE JUN DER
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