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Radiating fin structure and heat sink thereof

a technology of radiating fins and heat sinks, which is applied in the direction of tubular elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of increasing manufacturing costs, inconvenient use of thermal modules, and inability of conventional thermal modules to multi-directionally disperse heat, etc., and achieve excellent flow guiding effect

Inactive Publication Date: 2011-01-06
ASIA VITAL COMPONENTSSHEN ZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a heat sink with excellent flow guiding effect and can dissipate heat in multiple directions. The heat sink is manufactured at lower cost and is more easily manufactured and assembled. The fan is also easily replaceable. Overall, the heat sink has the advantage of providing excellent heat dissipation effect, reducing manufacturing labor and time, and lower manufacturing cost."

Problems solved by technology

In this case, not only the manufacturing cost is increased, but also it is inconvenient to use the thermal module 1.
Therefore, it is impossible for the conventional thermal module to multidirectionally dissipate the heat.
1. The manufacturing cost is higher.
2. The fan can be hardly commonly applied to the heat sink.
3. The heat dissipation efficiency is low.

Method used

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  • Radiating fin structure and heat sink thereof
  • Radiating fin structure and heat sink thereof
  • Radiating fin structure and heat sink thereof

Examples

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Embodiment Construction

[0024]Please refer to FIG. 3, which is a perspective view of the radiating fin of the present invention. The radiating fin 2 includes a main body 21. At least one input section 22 and at least one output section 23 oppositely extend from two ends of the main body 21 respectively. To speak more specifically, the input section 22 upward extends from one side of the main body 21, while the output section 23 downward extends from the other side of the main body 21. The input section 22 and the main body 21 contains a first angle 24 on one side of the main body 21, while the output section 23 and the main body 21 contains a second angle 25 on an opposite side of the main body 21. The first angle 24 is greater than 0 degree and less than 180 degrees. The second angle 25 is greater than 0 degree and less than 180 degrees. In addition, the radiating fin 2 has at least one perforation 26, which can be selectively formed on the main body 21, the input section 22 or the output section 23. In t...

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Abstract

A radiating fin structure and a heat sink thereof. The radiating fin structure includes a main body. At least one input section and at least one output section extend from two ends of the main body respectively. The input section and the main body contain a first angle. The output section and the main body contain a second angle. The heat sink is composed of multiple radiating fins, at least one heat pipe and at least one chassis. The heat pipe penetrates through and strings the radiating fins to form one or more radiating fin assemblies. The input sections of the radiating fins of one radiating fin assembly are adjacent to the output sections of the radiating fins of another radiating fin assembly to together define a central heat dissipation section and multiple spiral heat dissipation flow ways as multiple flow guide structures to achieve better heat dissipation effect.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a radiating fin structure and a heat sink thereof, and more particularly to a heat sink composed of multiple radiating fins with multiple flow guide structures for speeding convection of airflow so as to achieve better heat dissipation effect.BACKGROUND OF THE INVENTION[0002]Following the advance of semiconductor technology, the volumes of integrated circuits have become smaller and smaller. For processing more data, the number of components contained in a current integrated circuit is several times the number of components contained in a conventional integrated circuit with the same volume. The greater the number of the components contained in the integrated circuit is, the higher the heat generated by the integrated circuit in working is. As exemplified with a common central processor, under full-load condition, the heat generated by the central processor is high enough to burn out the entire central processor. Therefore...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F9/00F28F7/00F28D15/02
CPCF28D15/0275F28F1/30F28F1/34H01L23/3672H01L23/427H01L2924/0002H01L23/467H01L2924/00
Inventor ZENG, XIAOZHENLIU, YAWEN
Owner ASIA VITAL COMPONENTSSHEN ZHEN