Thermal module and manufacturing method thereof

Abstract

A thermal module includes a substrate and a heat pipe integrally embedded in the substrate by insert molding technique. An end of the heat pipe protrudes laterally out of the substrate. The heat pipe includes a tube, a wick structure attached to an inner surface of the tube and a working fluid filled in the tube. A method for manufacturing the thermal module includes following steps: providing a tube with a wick structure attached to an inner surface thereof, an end of the tube being open; placing the tube into a mold; injecting a molten metal into the mold to form a substrate with the tube being integrally embedded in the substrate and the open end of the tube protruding laterally out of the substrate; filling a working fluid into the tube via the open end; sealing the open end of the tube.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to a thermal module and a manufacturing method of the thermal module.[0003]2. Description of Related Art[0004]With continuing development of electronic technology, heat-generating electronic components such as CPUs (central processing units) are generating more and more heat which requires immediate dissipation. Generally, thermal modules are attached to the electronic components to provide such dissipation.[0005]A conventional thermal module includes a substrate, a fin assembly and a plurality of heat pipes connecting the fin assembly with the substrate. The substrate defines a plurality of elongated recesses for receiving the evaporator sections of the heat pipes. The evaporator sections of the heat pipes are respectively received in the recesses of the substrate and fixed to the substrate by soldering. Usually, a thermal interface material such as thermal grease is applied in the recesses to reduce air gaps be...

AI Technical Summary

Benefits of technology

[0005]A conventional thermal module includes a substrate, a fin assembly and a plurality of heat pipes connecting the fin assembly with the substrate. The substrate defines a plurality of elongated recesses for receiving the evaporator sections of the heat pipes. The evaporator sections of the heat pipes are respectively received in the recesses of the substrate and fixed to the substrate by soldering. Usually, a thermal interface material such as thermal grease is applied in the recesses to reduce air gaps between the heat pipes and the substrate. In manufacturing the thermal module, the substrate is defined with the recesses, and the heat pipes are assembled to the recesses of the substrate, which is time-consuming and complex. Furthermore, due to a technical restriction, the thermal grease can not be uniformly filled in a gap between the heat pipes and the substrate, which increases a heat resistance of the thermal module, and a heat dissipation capability of the thermal module is thus greatly reduced.

Problems solved by technology

In manufacturing the thermal module, the substrate is defined with the recesses, and the heat pipes are assembled to the recesses of the substrate, which is time-consuming and complex.

Furthermore, due to a technical restriction, the thermal grease can not be uniformly filled in a gap between the heat pipes and the substrate, which increases a heat resistance of the thermal module, and a heat dissipation capability of the thermal module is thus greatly reduced.

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