Optimizing PCB power and ground connections for lead free solder processes

Abstract

Apparatuses and methods that provide for enhanced connections between PTHs of multi-layer PCBs and electronic component leads, pins or the like. The apparatuses and methods improve the likelihood that the PTHs are completely filled with solder thereby advantageously allowing the PCBs to exhibit high mechanical and electrical reliability. Complete filling of PTHs is achieved by configuring the electrically conductive layers within the multi-layer PCB stack in a manner that reduces the heat sinking effects of the layers during the soldering process. In this regard, the PTHs may not directly contact all of the internal ground or power planes, so the heat sinking or heat transfer effects are reduced. This feature enables molten solder to substantially or completely fill an entire PTH before freezing.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a divisional of U.S. patent application Ser. No. 12 / 651,150, entitled “OPTIMIZING PCB POWER AND GROUND CONNECTIONS FOR LEAD FREE SOLDER PROCESSES”, filed on Dec. 31, 2009. The disclosure of this related application is hereby incorporated into the present application.BACKGROUND OF THE INVENTION[0002]Printed circuit boards, or PCBs, are generally used to mechanically support and electrically connect electronic components using conductive pathways, or traces etched from sheets of electrically conductive material (e.g., typically copper sheets) laminated onto a non-conductive substrate. A PCB populated with electronic components is referred to as a printed circuit assembly (PCA), also known as a printed circuit board assembly (PCBA). PCBs are generally rugged, inexpensive, and can be highly reliable. They require much more layout effort and higher initial cost than either wire-wrapped or point-to-point constructed circuits...

AI Technical Summary

Benefits of technology

"The present invention provides apparatuses and methods for improving the connection between electronic components and multi-layer printed circuit boards using lead-free solder processes. The invention involves enhancing the filling of solder in the plated through-holes of the circuit board, which reduces heat sinking and allows for better mechanical and electrical reliability. The invention also includes a design that optimizes the distribution of ground and power planes in the circuit board, reducing the likelihood of incomplete solder filling. Overall, the invention improves the reliability and efficiency of multi-layer printed circuit boards."

Problems solved by technology

They require much more layout effort and higher initial cost than either wire-wrapped or point-to-point constructed circuits, but are much cheaper and faster for high-volume production.

Too little flux will cause poor joints, while too much flux may cause cosmetic or other problems.

As the thickness of a PCB increases (e.g., above 100 mils, 150 mils, 200 mils, or more) and the combined weight of the copper sheets increases (e.g., above 0.5 oz, 1.0 oz, 1.5 oz, 2.0 oz, or more), it may become more difficult to successfully fill the PTHs during the soldering process.

One cause of the increased difficulty is that the molten solder tends to cool (“freeze”) prematurely before it has traveled from the bottom of the PCB to the top.

The problem of premature freezing of the molten solder can be particularly acute when lead free solder is used in the soldering process.

The multiple layers of copper sheets may conduct heat away from the molten solder (i.e., act as heat sinks), causing the solder to freeze prematurely and causing the PTH to be only partially filled with solder (e.g., 75% filled, 50% filled, or less).

When the PTH is only partially filled with solder, the mechanical and electrical integrity of the solder connection may be significantly reduced or may even be ineffective.

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