18 results about "Electrical integrity" patented technology

The invention belongs to the technical field of wafer processing, and discloses a multi-section high-flatness wafer cutting method which comprises the following steps: S1, wafer pretreatment and stress buffer layer preparation; s2, performing layered rough cutting by using a diamond blade; s3, plasma fine cutting and interface repairing; s4, performing multi-layer cooling and surface polishing; and S5, surface quality closed-loop detection is carried out. According to the method, copper layer residues and resin carbonization defects are synchronously eliminated. Cryogenic treatment induces lattice reconstruction through ultrafast phase change and blocks a chain reaction of dislocation defects, so that the intrinsic mechanical strength of the material is recovered, and a chemical mechanical polishing system activates the self-repairing characteristic of the material while removing a sub-surface damaged layer through the synergistic effect of abrasive chemical activity and mechanical shearing force, so that an atomic-scale smooth interface is formed, and the self-repairing performance of the material is improved. A closed-loop detection system depends on multi-dimensional data fusion and ion beam fixed-point repair, accurate positioning and performance recovery of cross-scale defects are achieved, and the electrical integrity of a chip functional area is ensured.

A releasable and re-seat-able locking electrical wireline wet connection associated with sections of wireline used in an HDD drill string in a borehole. Said connection comprising a male member on one end of the wireline section having an externally exposed electrical contact receptacle that connects to a subsequent wireline section by mating and locking on to the female member. Mating is achieved by a simple “J”-shaped set of latching features, a second axis having a conductive part extending into a hollow body whereby the electrical contact element is fastened to the wireline coaxial center conductor for electrical continuity and with the wireline's protective armor also physically secured inside the hollow body for extreme mechanical and electrical integrity during the HDD drilling process. Reliable electrical connections are established and maintained notwithstanding wet and contaminated contacts and continuous rotation and wireline tension.

This invention belongs to the technical field of carbon fiber cable cores, specifically disclosing a fire-resistant carbon fiber composite cable core and its preparation method. The preparation method includes the following steps: S1, preparing carbon fiber microrods with a diameter of 0.5~1.5mm; S2, preparing an interface functional layer: plasma treatment, followed by sequential coating to form an elastic reset layer and impregnation coating to form a microparticle friction layer; S3, bundling 19~61 carbon fiber microrods in parallel; S4, stranding a composite load-bearing core with tin-plated copper wire; S5, preparing a fire-resistant isolation layer and an insulating protective layer: wrapping with mica tape and fiberglass tape to form a fire-resistant isolation layer, then extruding a low-smoke halogen-free flame-retardant material after heating and melting it to form an insulating protective layer. This invention, using the above-mentioned fire-resistant carbon fiber composite cable core and its preparation method, improves the electrical integrity and resistance to fretting wear of the cable core under high temperature and fire conditions, while also improving the stability of mass production.

The application provides a deep silicon etching structure and a preparation method thereof. By introducing a sacrifice passivation layer into a first groove on the surface of a structure to be etched, a firm physical barrier is constructed by using the high etching selectivity of the sacrifice passivation layer relative to a deep silicon etching gas and the excellent etching resistance of the sacrifice passivation layer. When a deep silicon etching process is performed on an SOI substrate, the sacrifice passivation layer can effectively block the bombardment of high-energy plasma, greatly reducing the risk of damage to the metal layer, so as to ensure that the device will not fail due to the thinning, open circuit or short circuit of the metal layer, guaranteeing the electrical integrity of the device. Furthermore, compared with the traditional process, the application only needs to add one step of depositing the sacrifice passivation layer and one step of etching to open the window area of the deep silicon etching, so that the preparation process is simple and the production cost is significantly reduced.

This invention relates to the field of cable technology and discloses a cable conductor separator assembly and an insulated, armored, fire-resistant cable. The assembly includes a base disposed inside the cable conductor, several blocks disposed on the base, and several fourth plates, arranged in pairs at both ends of the blocks, for separating several conductor cores inside the cable conductor. By placing multiple separator assemblies inside the cable's outer sheath, this invention prevents direct contact between adjacent conductor cores, avoiding mutual compression and friction between multiple conductor cores, thus reducing the potential risk of short circuits and ensuring the electrical integrity and fire resistance of the cable conductor during use.

The utility model relates to the field of geodetic network monitoring, in particular to a distributed power distribution monitoring device. The utility model provides a distributed power distribution monitoring device which comprises a local monitoring cabinet and a plurality of outdoor monitoring boxes. The local monitoring cabinet comprises a first calculation unit and a plurality of first function units; the outdoor monitoring box comprises a second calculation unit and a plurality of second function units; the first functional unit is coupled with a plurality of first measuring sites located indoors through measuring cables, and the second functional unit is coupled with a plurality of second measuring sites located outdoors through measuring cables; the first computing unit and the second computing unit enable electrical integrity information transmission.

Light-emitting diode (LED) devices and more particularly die attach structures for LED chips on lead frames in LED packages are disclosed. Exemplary lead frame structures are provided with selectively plated metal layers at die attach regions for LED chips. The metal of the selectively plated metal layers is positioned to form alloys and / or intermetallic compounds with bonding materials employed for die attach of LED chips. The resulting alloys and / or intermetallic compounds form non-reflowable metal structures at and above temperatures utilized for subsequent attachment of LED packages in LED devices, thereby providing increased mechanical and electrical integrity of die attach for LED chips.

A method includes obtaining operating data regarding a plurality of Electrical Submersible Pump (ESP) systems in a field of interest. The operating data describe respective replacements of each of the ESP systems, respective compatibility type of each of the ESP systems, and ESP status data comprising: a hydrogen sulfide gas partial pressure, a type of Motor Lead Extension (MLE), a presence of sand, a run life history, an electrical integrity, a type of packer feedthrough, a motor load, a motor temperature, and a history of dormant time. The method includes determining a failure rate of a first compatibility type of ESP system using the operating data, determining whether the failure rate satisfies a predetermined criterion; and transmitting a command to alter an ESP. The method includes replacing one or more ESP systems with a replacement based on a selection of each ESP systems to be replaced on the display.

The present invention relates to a novel packaging structure for a bare die semiconductor sensor, specifically designed for diagnostic applications where direct fluid sample contact with the sensor's detection area is required. The packaged semiconductor sensor comprises a semiconductor die with a top surface featuring bond pads and a detection area, and a bottom surface. A support member with a top side, a bottom side, and a detection window forms a sample well for receiving a fluid sample when aligned with the detection area. Z-axis conductive adhesive electrically connects bond pads to conductive traces on the support member. A sealing member seals the sample well, preserving sensor functionality while allowing the detection area exposure to the sample. This innovative packaging solution protects the sensor from environmental factors and maintains electrical integrity, enabling accurate and efficient biomarker detection in diagnostic procedures.

The invention discloses a maintainable grounding device for assisting an astronaut in manual grounding on orbit, and belongs to the technical field of spaceflight equipment. The device mainly comprises a plugging and unplugging assembly and a fixing assembly, wherein the plugging and unplugging assembly comprises a plugging and unplugging device, a non-separation fastening device, a top bead mechanism and a connecting mechanism; the fixing assembly comprises a fixing plate and a mounting column. The plugging device is in butt joint connection with the mounting column, and rapid plugging and reliable fixing can be achieved through operation of an astronaut through a manual tool or an electric tool; locking of the plugging assembly and the fixing assembly can be achieved through the non-disengaging fastening device, loosening and disengaging are prevented, and on-orbit maintenance is facilitated; the top bead mechanism provides elastic force through a spring so that a top bead can be embedded into a ball socket groove of a fixing assembly, a self-locking structure is formed, and it is ensured that the structure is stable in the weightlessness or vibration environment. And the connecting mechanism realizes reliable electrical grounding with the replaceable equipment through the O-shaped terminal and the grounding wire, so that the safety and the electrical integrity of the equipment during on-orbit working are ensured.

The invention relates to the technical field of electric power systems, in particular to a pull type electrified load transfer device and a use method thereof.The device comprises a pull chassis, a square cabin, a cable winding and unwinding mechanism, a bypass load switch and a bypass system detection test platform, and the cable winding and unwinding mechanism is arranged in the square cabin; the bypass load switch is connected in series between the first bypass cable and the second bypass cable; the bypass system detection test platform comprises an insulation resistance tester and a conduction test indicator, and the bypass system detection test platform is used for performing an electrical integrity test on a bypass circuit; the bypass load switch, the cable take-up and pay-off mechanism, the bypass system detection test platform and other components are integrated, the construction time of field equipment before bypass operation is shortened, the residual service life of key insulation components is predicted, updating is carried out in combination with use records, and the operation efficiency is improved. And faults at positions such as a bypass cable or a switch connector in the use process are avoided.

The present application relates to nursing device technical field, disclose a kind of invisible stoma vibration underwear reminding monitoring system, including one distributed resistance network and microcontroller being arranged in underwear;Microcontroller is compared difference by establishing reference voltage division ratio between network nodes, and continuously monitors current voltage division ratio with the reference, when difference exceeds mutation threshold, drive reminding device.The present application shifts monitoring focus from tracking complex physiological parameters to guarding the electrical integrity of a stable physical system by using the relative stability of voltage division ratio, which can suppress global interference such as body temperature or deformation in structure, while showing high sensitivity to leakage-specific local electrical mutations, thereby achieving high-reliability early warning of leakage risk at very low power consumption.

The invention relates to the technical field of wires and cables, in particular to a high-flame-retardant medium-voltage aluminum alloy power cable for chemical equipment and a preparation method of the high-flame-retardant medium-voltage aluminum alloy power cable, and the high-flame-retardant medium-voltage aluminum alloy power cable comprises a cable core which is formed by wrapping and fixing a plurality of wire cores which are tangent in pairs and a filling layer filled among the wire cores by a flame-retardant wrapping layer into a circular cross section; the outer wall of the cable core is coated with the armor layer; the outer wall of the armor layer is coated with the flame-retardant layer; and the outer wall of the flame-retardant layer is coated with the reinforcing layer. According to the invention, a gradient insulation structure with soft inside and rigid outside is arranged, through continuous transition of material performance, concentrated shear stress generated by thermal expansion mismatch is effectively dispersed and absorbed, interface stripping and fatigue cracking of an insulation layer are inhibited, and electrical integrity and thermal mechanical stability of the cable under frequent temperature circulation are ensured.

Devices and methods are provided for using production devices during environmental testing. The structural and electrical integrity of external electrical connectors of a production device are determined, for instance, for board level reliability or second level solder joint reliability tests. Operational characteristics or internal connections of the production device can be monitored during testing.

The present application relates to the technical field of power system, specifically relates to a kind of towed live load transfer device and its use method, device includes towed chassis, shelter, cable take-up mechanism, bypass load switch and bypass system test test platform, cable take-up mechanism is set in the shelter inside;Bypass load switch is in series between first bypass cable and second bypass cable;Bypass system test test platform includes insulation resistance tester and conduction test indicator, bypass detection test platform is used to carry out electrical integrity test to bypass circuit;The present application is integrated by bypass load switch, cable take-up mechanism and bypass system test test platform and other components, reduces the construction time of field equipment before bypass operation, predicts the remaining useful life of key insulation components, and updates combined with use record, to avoid failure in the use process bypass cable or switch joint and so on position.

The invention relates to the technical field of cables, and discloses a cable conductor separation assembly and an insulated armored fireproof cable, comprising a base arranged inside a cable conductor, a plurality of block bodies arranged on the base, and a plurality of fourth sheet bodies arranged at two ends of the plurality of block bodies in pairs respectively, the cable conductor is used for separating a plurality of conductor wire cores in the cable conductor. According to the invention, the plurality of separation assemblies are arranged in the cable outer sheath, so that two adjacent conductor wire cores are not in direct contact, mutual extrusion and friction among the plurality of conductor wire cores and damage to an insulating layer are avoided, the potential risk of short circuit of the conductor wire cores is reduced, and the electrical integrity and fireproof barrier of the cable wire in use are ensured.

The utility model discloses a railway signal machine room grounding safety monitoring system, which is characterized in that an end forming monitoring unit, a lightning protection monitoring unit, an electrical integrity monitoring unit and a grounding resistance monitoring unit are respectively and electrically connected with a processing unit, and the processing unit is electrically connected with a communication unit; the lightning protection monitoring unit comprises an MCU, a voltage signal acquisition module, a current signal acquisition module, a signal conditioning module, a temperature acquisition module and a communication module. The voltage signal acquisition module and the current signal acquisition module are electrically connected with the MCU through the signal conditioning module, the temperature acquisition module is electrically connected with the MCU, and the communication module is in communication connection with the MCU. The beneficial effects of the utility model are that various on-line monitoring such as end forming monitoring, lightning protection monitoring, electrical integrity monitoring, grounding resistance monitoring and the like are realized, data of the lightning protection unit are recorded through lightning protection monitoring, and an alarm is rapidly given when the lightning protection unit is detected to be damaged and fail; through grounding resistance monitoring and electrical integrity monitoring, overall contact and connection condition monitoring of the grounding grid is realized, and lightning protection continuity is ensured.

Light-emitting diode (LED) devices and more particularly die attach structures for LED chips on lead frames in LED packages are disclosed. Exemplary lead frame structures are provided with selectively plated metal layers at die attach regions for LED chips. The metal of the selectively plated metal layers is positioned to form alloys and / or intermetallic compounds with bonding materials employed for die attach of LED chips. The resulting alloys and / or intermetallic compounds form non-reflowable metal structures at and above temperatures utilized for subsequent attachment of LED packages in LED devices, thereby providing increased mechanical and electrical integrity of die attach for LED chips.