10 results about "Electrical integrity" patented technology

This invention belongs to the technical field of carbon fiber cable cores, specifically disclosing a fire-resistant carbon fiber composite cable core and its preparation method. The preparation method includes the following steps: S1, preparing carbon fiber microrods with a diameter of 0.5~1.5mm; S2, preparing an interface functional layer: plasma treatment, followed by sequential coating to form an elastic reset layer and impregnation coating to form a microparticle friction layer; S3, bundling 19~61 carbon fiber microrods in parallel; S4, stranding a composite load-bearing core with tin-plated copper wire; S5, preparing a fire-resistant isolation layer and an insulating protective layer: wrapping with mica tape and fiberglass tape to form a fire-resistant isolation layer, then extruding a low-smoke halogen-free flame-retardant material after heating and melting it to form an insulating protective layer. This invention, using the above-mentioned fire-resistant carbon fiber composite cable core and its preparation method, improves the electrical integrity and resistance to fretting wear of the cable core under high temperature and fire conditions, while also improving the stability of mass production.

The application provides a deep silicon etching structure and a preparation method thereof. By introducing a sacrifice passivation layer into a first groove on the surface of a structure to be etched, a firm physical barrier is constructed by using the high etching selectivity of the sacrifice passivation layer relative to a deep silicon etching gas and the excellent etching resistance of the sacrifice passivation layer. When a deep silicon etching process is performed on an SOI substrate, the sacrifice passivation layer can effectively block the bombardment of high-energy plasma, greatly reducing the risk of damage to the metal layer, so as to ensure that the device will not fail due to the thinning, open circuit or short circuit of the metal layer, guaranteeing the electrical integrity of the device. Furthermore, compared with the traditional process, the application only needs to add one step of depositing the sacrifice passivation layer and one step of etching to open the window area of the deep silicon etching, so that the preparation process is simple and the production cost is significantly reduced.

The utility model relates to the field of geodetic network monitoring, in particular to a distributed power distribution monitoring device. The utility model provides a distributed power distribution monitoring device which comprises a local monitoring cabinet and a plurality of outdoor monitoring boxes. The local monitoring cabinet comprises a first calculation unit and a plurality of first function units; the outdoor monitoring box comprises a second calculation unit and a plurality of second function units; the first functional unit is coupled with a plurality of first measuring sites located indoors through measuring cables, and the second functional unit is coupled with a plurality of second measuring sites located outdoors through measuring cables; the first computing unit and the second computing unit enable electrical integrity information transmission.

Light-emitting diode (LED) devices and more particularly die attach structures for LED chips on lead frames in LED packages are disclosed. Exemplary lead frame structures are provided with selectively plated metal layers at die attach regions for LED chips. The metal of the selectively plated metal layers is positioned to form alloys and / or intermetallic compounds with bonding materials employed for die attach of LED chips. The resulting alloys and / or intermetallic compounds form non-reflowable metal structures at and above temperatures utilized for subsequent attachment of LED packages in LED devices, thereby providing increased mechanical and electrical integrity of die attach for LED chips.

A method includes obtaining operating data regarding a plurality of Electrical Submersible Pump (ESP) systems in a field of interest. The operating data describe respective replacements of each of the ESP systems, respective compatibility type of each of the ESP systems, and ESP status data comprising: a hydrogen sulfide gas partial pressure, a type of Motor Lead Extension (MLE), a presence of sand, a run life history, an electrical integrity, a type of packer feedthrough, a motor load, a motor temperature, and a history of dormant time. The method includes determining a failure rate of a first compatibility type of ESP system using the operating data, determining whether the failure rate satisfies a predetermined criterion; and transmitting a command to alter an ESP. The method includes replacing one or more ESP systems with a replacement based on a selection of each ESP systems to be replaced on the display.

The invention discloses a maintainable grounding device for assisting an astronaut in manual grounding on orbit, and belongs to the technical field of spaceflight equipment. The device mainly comprises a plugging and unplugging assembly and a fixing assembly, wherein the plugging and unplugging assembly comprises a plugging and unplugging device, a non-separation fastening device, a top bead mechanism and a connecting mechanism; the fixing assembly comprises a fixing plate and a mounting column. The plugging device is in butt joint connection with the mounting column, and rapid plugging and reliable fixing can be achieved through operation of an astronaut through a manual tool or an electric tool; locking of the plugging assembly and the fixing assembly can be achieved through the non-disengaging fastening device, loosening and disengaging are prevented, and on-orbit maintenance is facilitated; the top bead mechanism provides elastic force through a spring so that a top bead can be embedded into a ball socket groove of a fixing assembly, a self-locking structure is formed, and it is ensured that the structure is stable in the weightlessness or vibration environment. And the connecting mechanism realizes reliable electrical grounding with the replaceable equipment through the O-shaped terminal and the grounding wire, so that the safety and the electrical integrity of the equipment during on-orbit working are ensured.

The present application relates to nursing device technical field, disclose a kind of invisible stoma vibration underwear reminding monitoring system, including one distributed resistance network and microcontroller being arranged in underwear;Microcontroller is compared difference by establishing reference voltage division ratio between network nodes, and continuously monitors current voltage division ratio with the reference, when difference exceeds mutation threshold, drive reminding device.The present application shifts monitoring focus from tracking complex physiological parameters to guarding the electrical integrity of a stable physical system by using the relative stability of voltage division ratio, which can suppress global interference such as body temperature or deformation in structure, while showing high sensitivity to leakage-specific local electrical mutations, thereby achieving high-reliability early warning of leakage risk at very low power consumption.

The invention relates to the technical field of wires and cables, in particular to a high-flame-retardant medium-voltage aluminum alloy power cable for chemical equipment and a preparation method of the high-flame-retardant medium-voltage aluminum alloy power cable, and the high-flame-retardant medium-voltage aluminum alloy power cable comprises a cable core which is formed by wrapping and fixing a plurality of wire cores which are tangent in pairs and a filling layer filled among the wire cores by a flame-retardant wrapping layer into a circular cross section; the outer wall of the cable core is coated with the armor layer; the outer wall of the armor layer is coated with the flame-retardant layer; and the outer wall of the flame-retardant layer is coated with the reinforcing layer. According to the invention, a gradient insulation structure with soft inside and rigid outside is arranged, through continuous transition of material performance, concentrated shear stress generated by thermal expansion mismatch is effectively dispersed and absorbed, interface stripping and fatigue cracking of an insulation layer are inhibited, and electrical integrity and thermal mechanical stability of the cable under frequent temperature circulation are ensured.

The present application relates to the technical field of power system, specifically relates to a kind of towed live load transfer device and its use method, device includes towed chassis, shelter, cable take-up mechanism, bypass load switch and bypass system test test platform, cable take-up mechanism is set in the shelter inside;Bypass load switch is in series between first bypass cable and second bypass cable;Bypass system test test platform includes insulation resistance tester and conduction test indicator, bypass detection test platform is used to carry out electrical integrity test to bypass circuit;The present application is integrated by bypass load switch, cable take-up mechanism and bypass system test test platform and other components, reduces the construction time of field equipment before bypass operation, predicts the remaining useful life of key insulation components, and updates combined with use record, to avoid failure in the use process bypass cable or switch joint and so on position.

Light-emitting diode (LED) devices and more particularly die attach structures for LED chips on lead frames in LED packages are disclosed. Exemplary lead frame structures are provided with selectively plated metal layers at die attach regions for LED chips. The metal of the selectively plated metal layers is positioned to form alloys and / or intermetallic compounds with bonding materials employed for die attach of LED chips. The resulting alloys and / or intermetallic compounds form non-reflowable metal structures at and above temperatures utilized for subsequent attachment of LED packages in LED devices, thereby providing increased mechanical and electrical integrity of die attach for LED chips.