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An intelligent power module multi-physical field coupling simulation analysis method and system

An intelligent power module, multi-physics technology, applied in electrical digital data processing, special data processing applications, instruments, etc., can solve problems such as roughness and deviation of simulation results

Active Publication Date: 2019-05-21
SHANDONG NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional modeling methods usually use linear circuit elements and simplified circuit analytical models to solve, with a large number of rough approximations and oversimplified assumptions, ignoring these crucial basic physical mechanisms, the simulation results will be biased

Method used

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  • An intelligent power module multi-physical field coupling simulation analysis method and system
  • An intelligent power module multi-physical field coupling simulation analysis method and system
  • An intelligent power module multi-physical field coupling simulation analysis method and system

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Embodiment 1

[0036] This embodiment discloses a multi-physical field coupling simulation analysis method for an intelligent power module, which can predict the circuit characteristics, electromagnetic characteristics and heat dissipation characteristics of the intelligent power module in advance, and can intuitively understand the circuit operation, the mechanism of electromagnetic problems and the propagation of electromagnetic noise The way and the heat distribution, such as Figure 1-2 As shown, the method includes the following steps:

[0037] The intelligent power module includes 6 IGBT chips and a control chip, 3 AC terminals, 2 DC terminals, and others including logic, control, detection and other terminals.

[0038] Model generating step: generating an overall geometric model of the intelligent power module and a semiconductor circuit model. Specifically include:

[0039] (1) According to the schematic diagram of the intelligent power module circuit design, construct the correspo...

Embodiment 2

[0065] The purpose of this embodiment is to provide a computer system.

[0066] A computer system, comprising a memory, a processor, and a computer program stored in the memory and operable on the processor, when the processor executes the program, it realizes:

[0067] Constructing an overall geometric model of the intelligent power module according to the circuit design schematic diagram of the intelligent power module;

[0068] performing finite element mesh segmentation and discretization on the overall geometric model;

[0069] According to the overall geometric model after discretization, the parasitic parameters in the conductive path and current-carrying components are analyzed and the equivalent circuit model is generated;

[0070] Establish the electrical integrity model of the main circuit and control circuit;

[0071] Receive the boundary condition setting, solve the thermal field and magnetic field separately under the three-dimensional multi-layer boundary cond...

Embodiment 3

[0075] The purpose of this embodiment is to provide a computer-readable storage medium.

[0076] A computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, the following steps are performed:

[0077] Constructing an overall geometric model of the intelligent power module according to the circuit design schematic diagram of the intelligent power module;

[0078] performing finite element mesh segmentation and discretization on the overall geometric model;

[0079] According to the overall geometric model after discretization, the parasitic parameters in the conductive path and current-carrying components are analyzed and the equivalent circuit model is generated;

[0080] Establish the electrical integrity model of the main circuit and control circuit;

[0081] Receive the boundary condition setting, solve the thermal field and magnetic field separately under the three-dimensional multi-layer boundary condition,...

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Abstract

The invention discloses an intelligent power module multi-physical field coupling simulation analysis method and system, and the method comprises the steps: building an overall geometric model of an intelligent power module according to an intelligent power module circuit design schematic diagram; Performing finite element grid segmentation and discretization processing on the overall geometric model, performing analyzing to obtain parasitic parameters in a conductive path and a current-carrying element, and generating an equivalent circuit model; Establishing an electrical integrity model ofthe main circuit and the control circuit; Respectively solving the thermal field and the magnetic field, and establishing a stress-strain relationship and a failure model in the system level; Constructing a physical field coupling analysis model according to the stress-strain relationship, the failure model and the electrical integrity model; And based on the coupling analysis model, carrying outcurrent, magnetic field and heat dissipation state rule analysis. Parameter extraction, field distribution and coupling calculation of multi-physical field analysis can be carried out across differentfinite element analysis software, and multi-physical field coupling analysis under complex boundary conditions is completed.

Description

technical field [0001] The disclosure belongs to the field of multi-physics field simulation of high-power semiconductor devices, and in particular relates to a multi-physics field coupling simulation analysis method and system for an intelligent power module. Background technique [0002] With the development of modern electronic technology, power devices with insulated gate bipolar transistor (IGBT) as the core are becoming more and more important in the application of modern power electronic technology and many industrial control fields. As a typical bipolar MOS composite power device, IGBT combines the advantages of MOSFET and GTR (high-power transistor), and has the advantages of high input impedance, fast switching speed, good thermal stability and simple driving circuit. It also has the advantages of low on-state voltage, high withstand voltage and large current. Based on IGBT, the intelligent power module integrates logic, control, detection and protection circuits....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCY02E60/00
Inventor 华庆王春兴郑家兴
Owner SHANDONG NORMAL UNIV
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