Method and system for cooling apparatus racks

a technology for cooling apparatus and racks, applied in the field of cooling, can solve the problems of increasing the cost of data center floor space, not being economical to space computer units, and producing heat typically by computer units and electrical cables, so as to reduce the overall cost of data center cooling, increase capacity, and increase heat load

a technology for cooling apparatus and racks, applied in the field of cooling, can solve the problems of increasing the cost of data center floor space, not being economical to space computer units, and producing heat typically by computer units and electrical cables, so as to reduce the overall cost of data center cooling, increase capacity, and increase heat load

US20110209852A1Inactive Publication Date: 2011-09-01TELIASONERA

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for cooling apparatus racks
  • Method and system for cooling apparatus racks
  • Method and system for cooling apparatus racks

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038]Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

[0039]FIG. 2 illustrates a system for cooling apparatus racks in one embodiment of the invention. The system comprises a first cooling unit 260 and a second cooling unit 270. The cooling units may be similar as common air conditioning units or CRAC units. An example of a preferred embodiment for a cooling unit suitable for the invention is disclosed in EP958720B1.

[0040]The cooling unit may also have a primary cooling circuit with internal cooling battery. The primary cooling circuit may be coupled to a secondary cooling circuit that dissipates the heat load by free cooling, chillers or to preferred location outside the data centre, such as to water from a river or to outdoor air. The secondary cooling circuit may be any system known to a skilled man in the art.

[0041]Cooling units 260 and 270 have respective primary cooling circuit inl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a system and method that comprises at least two parallel apparatus racks and at least two cooling units. The cooling units are configured to produce horizontal cooled airflows toward outer sides of the at least two apparatus rack. The cooling units comprise an upper side inlet for airflow to be cooled. The system and method achieve a more effective cooling of apparatus racks.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The invention relates to cooling. Particularly, the invention relates to a method and a system for cooling apparatus racks, especially with high heat loads.[0003]2. Description of the Related Art[0004]Apparatus racks are used to house interrelated electronic or otherwise functional devices with a similar or related heat dissipation function. The electronic devices may represent stripped down versions of devices such as a computers that might otherwise be provided with a separate housing or cover. The devices are usually connected with an electrical connection. The racks are usually provided with shared power units and in some cases shared fan trays. The electronic devices are typically computer units comprising microprocessors, memory circuits and hard disc units. Also other devices producing heat loads may be installed into an apparatus rack. A rack may typically comprise a conventional horizontally mounted server, ver...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
01 Sep 2011
Publication
US20110209852A1
IPC
F28D15/00
CPC
H05K7/20745
Inventors
ENLUND, SVANTE