Method and system for cooling apparatus racks

Abstract

The invention relates to a system and method that comprises at least two parallel apparatus racks and at least two cooling units. The cooling units are configured to produce horizontal cooled airflows toward outer sides of the at least two apparatus rack. The cooling units comprise an upper side inlet for airflow to be cooled. The system and method achieve a more effective cooling of apparatus racks.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The invention relates to cooling. Particularly, the invention relates to a method and a system for cooling apparatus racks, especially with high heat loads.[0003]2. Description of the Related Art[0004]Apparatus racks are used to house interrelated electronic or otherwise functional devices with a similar or related heat dissipation function. The electronic devices may represent stripped down versions of devices such as a computers that might otherwise be provided with a separate housing or cover. The devices are usually connected with an electrical connection. The racks are usually provided with shared power units and in some cases shared fan trays. The electronic devices are typically computer units comprising microprocessors, memory circuits and hard disc units. Also other devices producing heat loads may be installed into an apparatus rack. A rack may typically comprise a conventional horizontally mounted server, ver...

AI Technical Summary

Benefits of technology

The invention is about a method and system for cooling a device mounted to an apparatus rack. The method involves using two parallel rows of cooling units to create a cooling wall around the rack, with one row of units placed on either side of the rack. The cooling units produce a horizontal laminar airflow that is evenly distributed over the rack. The system also includes a first cover to separate the cooling space between the first and second rows of devices mounted to the rack. The invention provides improved cooling efficiency and better protection of the device from heat.

Problems solved by technology

A problem of apparatus racks is the production of heat typically by computer units and electrical cables.

In data centers it is not economical to space the computer units with a sufficient distance from one another to get rid of active cooling.

This increases the cost of a data center's floor space significantly.

Abnormal hot spots in a rack mounted device may lead to breakage of the device or to reduced service level.

The problem in existing cooling system such as illustrated in FIG. 1 is the power consumption required to keep the racks at a sufficiently low temperature.

This creates high requirements for the heat dissipation, for example, through secondary circuit and limits the free-cooling period severely.

The problem is exacerbated by a more tight packing of circuit boards in apparatus racks typically in modern blade servers.

Another problem of an arrangement as illustrated in FIG. 1 is, that it is possible to mount a single device into the rack in a reverse manner, i.e. the air flow is directed opposite to the general hot aisle-cold aisle configuration.

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