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Cooling device

a cooling device and cooling technology, applied in semiconductor lasers, semiconductor/solid-state device details, lighting and heating apparatus, etc., can solve the problems of affecting the cooling effect of the cooling device, and the failure of the peltier element, etc., to achieve the effect of convenient attachmen

Inactive Publication Date: 2011-09-22
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a cooling device that is easy to attach and ensures intimate contact at the contact surface between a heat absorbing surface of a Peltier element and an object to be cooled, and the contact surface between a heat radiating surface of the Peltier element and a cooling part. The cooling device includes a Peltier element, a heat absorbing plate, a heat radiating plate, heat conducting members, and a spacer. The attachment is easy and intimate contact is ensured at the contact surface between the heat absorbing surface of the Peltier element and the object to be cooled, and the contact surface between the heat radiating surface of the Peltier element and the cooling part.

Problems solved by technology

However, the Peltier element may be broken or the performance may be degraded when proper pressure cannot be applied to the Peltier element.
Also, in a method in which commonly used screws are tightened diagonally to defined torque in some steps, the attached surfaces cannot be kept parallel and unbalanced load will be applied to the Peltier element.
Also, attaching work takes time and productivity is lowered in the method of diagonally tightening screws to defined torque in some steps.
In Patent Document 1, the Peltier element, heat generating object, and heat conducting part are arranged in intimate contact as they are pressurized by the pressurizing part, but it does not disclose a method for ensuring intimate contact at the contact surface between the Peltier element and the heat generating object and the contact surface between the Peltier element and the heat conducting part.

Method used

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Examples

Experimental program
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first preferred embodiment

[0019]FIG. 1 is a schematic diagram illustrating a cooling structure for a laser light source device having a cooling device 1 according to a first preferred embodiment of the present invention. As shown in FIG. 1, a laser light source device 11 is a semiconductor laser light source device that emits monochromatic laser light, and it generates heat while operating and the wavelength and power of the output light vary as the temperature varies. For example, the laser light source device 11 is used as a light source for a projection type display apparatus for displaying images in an enlarged manner. The laser light source device 11 is not limited to a semiconductor laser light source device, but it can be any light source device, such as an LED (Light Emitting Diode) device, for example. Also, while this preferred embodiment describes a cooling device for a light source device of a projection type display apparatus as an example, it is not limited to a projection type display apparatu...

second preferred embodiment

[0035]In the first preferred embodiment, the heat conducting grease 4 is used as a heat conducting member between the Peltier element heat absorbing surface 2a and the heat absorbing plate 5 and between the Peltier heat radiating surface 2b and the heat radiating plate 6. In a second preferred embodiment of the present invention, a heat conducting rubber sheet 16 is provided as a heat conducting member between the Peltier element heat absorbing surface 2a and the heat absorbing plate 5. In other respects, the structure and operation are the same as those of the first preferred embodiment and they are not described here again.

[0036]FIG. 4 is a cross-sectional view of a cooling device 1 according to the second preferred embodiment of the present invention, and it is a cross-sectional view of a cooling device 1 seen from this side to the depth side in FIG. 1. FIG. 4 does not show the heat pipes 13 and 14.

[0037]As shown in FIG. 4, a heat conducting rubber sheet 16 is provided as a heat ...

third preferred embodiment

[0040]In the first and second preferred embodiments, the heat radiating plate 6 is fixed to the spacers 3 with the screws 7. In a third preferred embodiment of the present invention, the heat radiating plate 6 is fixed by plate springs 17 attached to the spacers 3 with screws 18. In other respects, the structure and operation are the same as those described in the first and second preferred embodiments and they are not described again here.

[0041]FIG. 5 is a cross-sectional view of a cooling device 1 according to the third preferred embodiment of the present invention. As shown in FIG. 5, the plate springs 17 deform as they apply pressing force to the heat radiating plate 6, and pressurize the Peltier element 2 by applying reactive force to the heat radiating plate 6 according to the amount of deformation. That is to say, the plate springs 17 presses the heat radiating plate 6 toward the heat absorbing plate 5. The pressure applied to the Peltier element 2 can be kept at a given pres...

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PUM

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Abstract

An object of the present invention is to provide a cooling device that is easy to attach and that ensures intimate contact at a contact surface between a heat absorbing surface of a Peltier element and an object to be cooled and a contact surface between a heat radiating surface of the Peltier element and a cooling part. A cooling device according to the present invention includes a Peltier element having a heat absorbing surface and a heat radiating surface that are opposite each other; a heat absorbing plate having a first Peltier element attaching surface and located with the first Peltier element attaching surface facing the heat absorbing surface of the Peltier element; a heat radiating plate having a second Peltier element attaching surface and located with the second Peltier element attaching surface facing the heat radiating surface of the Peltier element; heat conducting members having viscosity or elasticity and provided between the heat absorbing surface and the first Peltier element attaching surface and between the heat radiating surface and the second Peltier element attaching surface; and a spacer provided between the heat absorbing plate and the heat radiating plate in parallel with the Peltier element and defining an opposing distance between the first and second Peltier element attaching surfaces.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to cooling devices, and particularly to a cooling device using Peltier elements.[0003]2. Description of the Background Art[0004]Peltier elements are temperature control devices that utilize the Peltier effect that heat moves from one metal to the other metal when an electric current is passed through the junction of the two kinds of metals. Cooling devices using Peltier elements can be small-sized. Also, Peltier elements can be current-controlled, so that they are suitable for the cooling of parts whose operating performance varies with temperature, such as semiconductor laser devices.[0005]A Peltier element has two metal surfaces including a heat absorbing surface where heat absorption occurs and the temperature falls and a heat radiating surface where heat generation occurs and the temperature rises when a control current is passed. When using a Peltier element as a cooling device, an obj...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F25B21/02
CPCH01L23/38H01L23/427H01S5/02469H01L2924/0002H01L2924/00
Inventor KOJIMA, TAKASHIMURATA, TAISUKEKADOWAKI, KAZUO
Owner MITSUBISHI ELECTRIC CORP