Hybrid heat-radiating substrate and method of manufacturing the same
a heat-radiating substrate and hybrid technology, applied in the direction of superimposed coating process, conductive pattern formation, coating, etc., can solve the problems of heat-radiating problem caused by heat-generating elements mounted on the substrate, difficult to implement high density/integration of heat-radiating substrate, etc., to achieve the effect of reducing thermal conductivity
Inactive Publication Date: 2011-12-15
SAMSUNG ELECTRO MECHANICS CO LTD
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Benefits of technology
[0008]The present invention has been made in an effort to provide a hybrid heat-radiating substrate including a metal core layer in order to keep heat-radiating performance of heat generating elements, an oxide insulating core layer having lower thermal conductivity than the metal core layer that is integrally formed with the metal core layer by volume anodizing, and thermally weakened elements that is mounted on an oxide insulating core layer, thereby making it possible to protect thermally weakened elements even though heat generating elements and thermally weakened elements are mounted on a single substrate together.
Problems solved by technology
Recently, a heat-radiating problem caused by heat generating elements mounted on the substrate has been an issue.
The heat-radiating substrate has excellent heat-radiating property as compared to a general organic PCB; however, it is difficult to implement high density / integration of the heat-radiating substrate.
Method used
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[0025]Various features and advantages of the present invention will be more obvious from the following description with reference to the accompanying drawings.
[0026]The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe most appropriately the best method he or she knows for carrying out the invention.
[0027]The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. In the specification, in adding reference numerals to components throughout the drawings, it is to be noted that like reference numerals designate like component...
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Abstract
Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.
Description
CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2010-0056616, filed on Jun. 15, 2010, entitled “Hybrid Heat-Radiating Substrate and Method Of Manufacturing The Same” which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a hybrid heat-radiating substrate and a method of manufacturing the same.[0004]2. Description of the Related Art[0005]Recently, the use of multi-functional electronic devices has expanded. Considering characteristics of these products, various electronic components should be mounted on a single substrate. Recently, a heat-radiating problem caused by heat generating elements mounted on the substrate has been an issue. In order to solve the heat-radiating from these heat generating elements, various types of heat-radiating substrates using metal materials with good thermal conductivity ha...
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IPC IPC(8): H05K1/03H05K3/44C23C28/00
CPCH05K1/0203H05K1/053H05K3/108H05K3/44H05K3/445Y10T29/4913H05K2201/09745H05K2201/10166H05K2203/0315H05K3/10H05K2201/062
Inventor LIM, CHANG HYUNKANG, JUNG EUNPARK, HEUNG SOOCHOI, SEOG MOONKIM, KWANG SOOCHAE, JOON SEOKPARK, SUNG KEUN
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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