Single event upset hardened static random access memory cell
a memory cell and single event technology, applied in static storage, information storage, digital storage, etc., can solve the problems of ineffective damping of seu, srams are more susceptible to single event upsets (seus) or soft errors, and conventional six-transistor memory cells employing cross-coupled resistor based isolation
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second embodiment
[0021]Referring now to FIG. 2b, there is illustrated a circuit diagram of an SEU- hardened SRAM cell, in accordance with the present invention. As shown, an SRAM cell 20′ is similar to SRAM cell 20 from FIG. 2a. The difference between SRAM cell 20′ and SRAM cell 20 is that SRAM cell 20′ includes a capacitor Cm connected between node n1 and node n2.
[0022]Capacitor Cm is preferably made of metal-insulator-metal (MIM) because it occupies less physical area. However, capacitor Cm may be constructed with materials other than aluminum and a dielectric insulator. Other structures that may be used for capacitor Cm include poly-poly capacitors, trench capacitors, etc. In addition, capacitor Cm can be physically placed, for example, above transistors 21-24 in a vertical dimension in order to share the same silicon footprint with transistors 21-24.
[0023]MIM capacitor Cm provides positive feedback during an SEU event on a positively biased drain of one of transistors 22 or 24 storing a “1” in S...
third embodiment
[0024]With reference now to FIG. 2c, there is illustrated a circuit diagram of an SEU-hardened SRAM cell, in accordance with the present invention. As shown, an SRAM cell 20″ is similar to SRAM cell 20′ from FIG. 2b. The difference between SRAM cell 20″ and SRAM cell 20′ is that SRAM cell 20″ includes two additional capacitors C1 and C2. Preferably, capacitor C1 is connected to node n1, and capacitor C2 is connected to node n2.
[0025]As has been described, the present invention provides a SEU-hardened memory cell to be utilized in SRAMs. The present invention may be implemented in a variety of apparatuses having an SRAM. For example, referring now to FIG. 3, there is depicted a block diagram of an apparatus in which an SRAM may be incorporated. As shown, the apparatus includes an electronic system 70 coupled to a memory device 60. Electronic system 70 may be, for example, a processor, a memory controller, a chip set or any system that stores data in a memory device such as memory dev...
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