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Cmc anchor for attaching a ceramic thermal barrier to metal

a technology of ceramic coating and metal structure, which is applied in the direction of machines/engines, manufacturing tools, light and heating equipment, etc., can solve the problems of limited protection to less than 2 mm thick layers, cracking of coatings, and limited protection

Inactive Publication Date: 2012-06-14
SIEMENS ENERGY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Various processes and thermal barrier compositions have been used, but usually have been limited to layers less than 2 mm thick due to thermal expansion differences between the coating and the metal.
This limits the amount of protection provided by these coatings, and leads to high thermal gradients in the coating, which can cause spalling.
Differential thermal expansion can crack the coating and weaken the bond with the protected substrate material.
The problem with all these solutions is the temperature limitation of the metallic interlayers.
For porous or thin-walled metal structures, oxidation resistance is severely compromised by high surface area and rapid depletion of protective oxide forming elements.
Thus, the compliant member becomes the temperature limiting feature of such designs.

Method used

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  • Cmc anchor for attaching a ceramic thermal barrier to metal
  • Cmc anchor for attaching a ceramic thermal barrier to metal
  • Cmc anchor for attaching a ceramic thermal barrier to metal

Examples

Experimental program
Comparison scheme
Effect test

embodiment 103

[0047]FIG. 11 illustrates an embodiment 103 with no separation sheet or void between the metal 40 and ceramic 38.

[0048]1. Fill the CMC honeycomb 20 with a leachable, non-wetting ceramic core 53 in a layer at the desired metal / ceramic coating interface as in FIG. 9.

[0049]2. Cast or deposit metal 40 against one side of the core 53.

[0050]3. Leach away the core 53.

[0051]4. Cast or deposit ceramic 38 against the metal.

embodiment 104

[0052]FIG. 12 illustrates an embodiment 104 with a compliant ceramic buffer layer such as a fibrous ceramic felt or blanket 55 between the metal 40 and ceramic 38.

[0053]1. Fill the CMC honeycomb 20 with a leachable, non-wetting ceramic core 53 in a layer at the desired metal / ceramic coating interface as in FIG. 9.

[0054]2. Cast or deposit metal 40 against one side of the core 53.

[0055]3. Leach away the core 53.

[0056]4. Deposit ceramic fibers 55 against the metal inner surface.

[0057]5. Cast or deposit ceramic 38 against the ceramic fibers 55.

[0058]In another fabrication method, ceramic 38 can be deposited into the CMC anchor, and then cured, creating the ceramic layer 38 with an inner surface or interface plane. For embodiment 103 the metal 40 may then be deposited against the ceramic inner surface, allowing some infusion of the metal into the ceramic layer porosity. If infusion is not wanted, a non-wetting layer can be applied to the ceramic layer prior to applying the metal. For emb...

embodiment 105

[0060]FIG. 15 illustrates an embodiment 105 in which CMC anchor walls 32 protrude through the metal substrate 40, and are attached to the backside of the metal. This allows a lower-temperature joining process, such as brazing 58 or even mechanical attachment in a manner that creates an interlock between the metal 40 and passages 36 in the CMC anchor.

[0061]While various embodiments of the present invention have been shown and described herein, it will be obvious that such embodiments are provided by way of example only. Numerous variations, changes and substitutions may be made without departing from the invention herein. For example, the honeycomb structure may be a fully infused CMC material, or it may be only partially infused with matrix material so that it is somewhat porous, thereby allowing the infusion of the respective ceramic 38 or metal 40 layers to further strengthen those layers. Alternatively, the sheet 30 may be infused to a different degree than the walls 32 of the ho...

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PUM

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Abstract

A ceramic matrix composite (CMC) anchor (20, 100) joining a metal substrate (40) and a ceramic thermal barrier (38). The CMC anchor extends into and interlocks with the ceramic barrier, and extends into and interlocks with the metal substrate. The CMC anchor may be a honeycomb (20) or other extending-into-and-interlocking geometry. A CMC honeycomb may be formed with first (22) and second (24) arrays of cells (26) with open distal ends (28) on respective opposite sides of a sheet (30). The cells may have walls (32) with transverse passages (36). A metal (40) may be deposited into the cells and passages on one side of the sheet, forming a metal substrate locked into the honeycomb. A ceramic insulation material (38) may be deposited into the cells and passages on the opposite side of the sheet, forming a layer of ceramic insulation locked into the honeycomb.

Description

FIELD OF THE INVENTION[0001]The invention relates generally to mechanisms for attaching ceramic coatings to metal structures, and more particularly to attaching a ceramic thermal barrier coating to a metallic component by means of a mutually interlocked ceramic matrix composite (CMC) honeycomb.BACKGROUND OF THE INVENTION[0002]Metal structures in high temperature environments such as in gas turbines may be coated with a protective ceramic insulating layer called a thermal barrier coating (TBC). Various processes and thermal barrier compositions have been used, but usually have been limited to layers less than 2 mm thick due to thermal expansion differences between the coating and the metal. This limits the amount of protection provided by these coatings, and leads to high thermal gradients in the coating, which can cause spalling. Differential thermal expansion can crack the coating and weaken the bond with the protected substrate material.[0003]Other approaches to adhering ceramic c...

Claims

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Application Information

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IPC IPC(8): B32B3/12B32B18/00B32B7/04B32B15/04B32B3/30B32B3/26
CPCC04B35/80Y10T428/24744C22C1/1015C22C1/1036C22C29/00B28B23/0018F01D5/288F05D2300/6033F05D2250/283F23R3/007F23M2900/05004Y10T428/24165Y10T428/24496Y10T428/24289Y10T428/24174Y10T428/24157Y10T428/24587Y10T428/24149Y10T428/24529Y10T428/24331Y10T428/24322C04B2235/616B33Y80/00C04B37/021C04B37/025C04B2237/38C04B2237/592Y10T428/249953Y10T428/31678
Inventor KELLER, DOUGLAS A.MORRISON, JAY A.GONZALEZ, MALBERTOMARINI, BONNIE D.
Owner SIEMENS ENERGY INC