Thin-type heat pipe structure

Abstract

A thin-type heat pipe structure includes a flat pipe, a second capillary structure, a third capillary structure, and a working fluid. The flat pipe has two boards and a containing chamber. A first capillary structure is set on the inner surface of the boards. The second capillary structure is contained in the containing chamber and covers a part of the first capillary structure. The third capillary structure is a stripe, contained in the containing chamber and clipped between the second capillary structure and another part of the first capillary structure. The working fluid is filled in the containing chamber. The overall design speeds up inner air's outflow and inner liquid's backflow.

Description

BACKGROUND[0001]1. Technical Field[0002]The present invention generally relates to a heat pipe, and more particularly, to a thin-type heat pipe structure that is used to guide heat generated by an electronic heat source.[0003]2. Related Art[0004]The exacerbating problems caused by electronic heat sources can be resolved by using heat pipes to conduct or dissipate heat generated by electronic products. Replacing cooling structures formed by cooling fins with heat pipes seems to be the future development trend. However, because electronic products generally have to be light, thin, short, and small, only a small space can be provided to heat pipes. As a result, the industry desires to have new heat pipe designs to resolve the problem.[0005]A conventional heat pipe generally includes a round pipe, a capillary structure, and a working fluid. Inside the round pipe there is a containing chamber. The capillary structure is set inside the containing chamber and stuck to the inner surface of ...

AI Technical Summary

Benefits of technology

The present invention provides a thin-type heat pipe structure by staking and arranging several capillary structures. This speeds up the flow of inner air and liquid. The capillary structures have different densities and can accumulate inner liquid and prevent dry out. The staking of the capillary structures enhances the overall capillary absorption force. This invention improves the heat transfer efficiency and provides better cooling for electronic devices.

Problems solved by technology

However, because electronic products generally have to be light, thin, short, and small, only a small space can be provided to heat pipes.

However, conventional heat pipes are round and hence are not suitable for electronic products that should be as thin as possible.

If the density of the capillary structure is high, the inner air will flow out swiftly when receiving heat, causing the heat receiving area to dry out quickly.

If the density of the capillary structure is low, the heat pipe will be inefficient in conducting heat, and resulting in some problems that must be resolved.

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