Heat pipe structure

Abstract

A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a volume larger than a volume of the second capillary structure but smaller than one half of a circumference of inner wall face of the chamber. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates generally to a heat pipe structure, and more particularly to a heat pipe structure, which is able to reduce thermal impedance pressure and greatly enhance the vapor-liquid circulation of the working fluid in the heat pipe and increase the heat transfer efficiency.[0003]2. Description of the Related Art[0004]There is a more and more obvious trend to miniaturization of all kinds of high-performance computers, intelligent electronic devices and other electrical equipments. To catch up this trend, the heat transfer components and heat dissipation components used in these devices have also been more and more miniaturized and thinned to meet the requirements of users.[0005]It is known that heat pipe is a heat transfer component with excellent thermal conductivity. The thermal conductivity of the heat pipe is several times to several tens times the thermal conductivity of copper, aluminum or the l...

AI Technical Summary

Benefits of technology

The present invention provides a heat pipe structure with enhanced heat conduction and transfer efficiency, and reduced thermal impedance pressure. This structure can handle greater thermal power impact per unit area and increase the maximum heat transfer efficiency. Additionally, it has better anti-gravity performance.

Problems solved by technology

However, this leads to another problem.

When compressing the flat-plate heat pipe, the capillary structure, (that is, the sintered metal powder or mesh capillary structure body) in the flat-plate heat pipe on two sides of the compressed faces is likely to be squeezed and damaged.

This will greatly deteriorate the heat transfer performance of the thin heat pipe or even make the thin heat pipe lose its function.

Moreover, although the flat-plate heat pipe can conduct the heat, after thinned and flattened, the internal capillary structure of the flat-plate heat pipe will have insufficient capillary attraction.

As a result, the anti-gravity thermal efficiency and heat transfer efficiency are poor.

Images