High-heat-flux graphite heat conduction film module stacking method

Abstract

The invention provides a high-heat-flux graphite heat-conducting film module stacking method. The method comprises the following steps of taking a plurality of graphite film raw materials; and stacking the graphite film raw materials on an operation table in sequence to form a graphite film module. The thick graphite film raw materials is a high-power heat-conducting graphite film and is a high-power graphite film raw material formed by burning an ultra-thick PI film (more than or equal to 125 microns) prepared by doping graphene and carbon nanotubes into traditional polyimide, and the thin graphite film raw material is a graphite film formed by burning a conventional polyimide material. The thick graphite film raw material is tightly attached to a heat source, so that the purposes of vertical high-heat-flux heat conduction and horizontal high-energy heat storage of heat energy of the heat source are achieved. The thin graphite film raw material plays a role in heat homogenization, thethick graphite film raw material and the thin graphite film raw material are bonded through glue with a certain thickness, due to the thermal resistance effect of the glue, the high heat conduction efficiency of the heating end can be improved through the high-power graphite film module, and it is guaranteed that when heat conduction is conducted in electronic equipment, a shell of the electronicequipment cannot be overheated, and a human body cannot be scalded.

Description

technical field [0001] The invention relates to the technical field of graphite modules, in particular to a stacking method of high heat flux graphite heat conduction film modules. Background technique [0002] At present, with the acceleration of the operation speed of electronic products, the demand for heat dissipation is becoming more and more stringent; thermally conductive graphite film is widely used in electronic products because of its ultra-high thermal conductivity; [0003] Limited by the thickness of the material, a single layer cannot meet the heat dissipation requirements. At present, multi-layer stacking is often used to improve its comprehensive thermal conductivity. [0004] At present, most of the stacked monomers are 17-100um heat-conducting graphite film combination or stacking with equal thickness. Although the stacking scheme promotes the overall heat uniformity effect, the heat dissipation efficiency at the heat source is hindered due to the negative ...

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Problems solved by technology

[0003] Limited by the thickness of the material, a single layer cannot meet the heat dissipation requirements. At present, multi-layer stacking is often used to improve its overall thermal conductivity.

[0004] At present, most of the stacked monomers are 17-100um thermal conductive graphite film combination or stacked with equal thickness. Although the stacking scheme promotes the overall heat uniformity effect, the heat dissipation efficiency at the heat source is hindered due to the negative impact of the thermal resistance of the glue, which indirectly affects mobile phone electronics. The operating efficiency and service life of the device; therefore, there is a lack of a preparation method that can improve the graphite thermal film module, which is used to improve the thermal conductivity of its electronic equipment

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