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Processess and compositions for removing substances from substrates

a technology of organic substances and compositions, applied in the field of removal of organic substances from substrates, can solve the problems of almost wholly negative and unnecessary further testing, and achieve the effects of improving the safety of operations, improving the consistency of chemistry, and rapid processing of parts

Inactive Publication Date: 2013-10-17
VERSUM MATERIALS US LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides several embodiments for a process to remove organic substances from substrates. These embodiments involve coating the organic substance with a stripping composition, heating the substrate to release the organic substance, and rinsing the substrate with a rinsing agent to remove the composition and organic resin. The stripping composition can contain organic solvent and a water soluble or dispersible polymer or monomer. The process can be used to remove organic substances of different thicknesses and can also include the use of a surfactant in the rinsing agent. The technical effect of the invention is to provide a simple and effective method for removing organic substances from substrates.

Problems solved by technology

With the exception of xylene sodium sulfonate, the results were almost wholly negative, and further testing was deemed unnecessary.
Very few solutions exhibited success in cleaning both PHOST and Novolac photoresist, and the few compositions that did have this success were questionable solutions that were non-ideal for use in this invention.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0099]Table 4 contains the results from a cleaning study conducted for Novolac resin coated as described in Table 1. Resin was cured for 15 minutes at 200° C. Process temperatures for the cleaning stage were 100° C., 150° C., and 200° C.

TABLE 4Solution (wt %)Process ConditionsDE150° C.150° C.200° C.200° C.IDEGSolventfor 60 sfor 90 sfor 30 sfor 60 s29.64%70.36%0.00%NotCleanNotCleanCleanClean15.96%84.04%0.00%NotCleanNotNotCleanCleanClean25.08%74.92%0.00%CleanCleanCleanClean15.96%38.04%46.00%NotCleanNotNotCleanCleanClean25.08%59.92%15.00%NotCleanNotNotCleanCleanCleanI—Sodium salt of the diethylene glycol diester of 5-sulfoisophthalic acidDEG—Diethylene glycolDE Solvent—Diethylene glycol ethyl ether

example 2

[0100]Table 5 contains the results from a cleaning study conducted for Phost resin coated as described in Table 1. Resin was cured for 15 minutes at 200° C. All cleaning compositions are comprised of 6 wt % sulfopolyester, 24 wt % DE Solvent, with the remaining 70 wt % being comprised of two additives as noted in Table 6. Process temperatures for the cleaning stage were 100° C., 150° C., and 200° C.

TABLE 5Solution (wt %)Process ConditionsDE100° C. for100° C. for150° C. forIDEGSolvent30 s60 s60 s29.64%70.36%0.00%CleanCleanClean15.96%84.04%0.00%CleanCleanClean25.08%74.92%0.00%CleanCleanClean15.96%38.04%46.00%CleanCleanClean25.08%59.92%15.00%CleanCleanCleanI—Sodium salt of the diethylene glycol diester of 5-sulfoisophthalic acidDEG—Diethylene glycolDE Solvent—Diethylene glycol ethyl ether

[0101]Examples 1 and 2 demonstrate the utility of invention in cleaning cured Novolac and polyhydroxystyrene resins from silica wafers. In the case of polyhydroxystyrene resin (Example 2), all cleaning...

example 3

[0102]Table 6 contains the results from a cleaning study conducted to test compositions containing 20 weight percent 5-sodiosulfoisophthalic acid (SSIPA), 5-lithiosulfoisophthalic acid (LiSIPA), the ethylene glycol diester of 5-sodiosulfoisophthalic acid (EGSIPA diester), and the diethylene glycol ethyl ether diester of 5-sodiosulfoisophthalic acid (DESIPA diester) as cleaning compositions to remove Novolac and polyhydroxystyrene resins. Resins were cured for 15 minutes at 200° C. Process temperatures for the cleaning stage were 100° C. for 60 seconds.

TABLE 6Wt %MonomerMonomerSolventNovolacPhostSSIPA20Diethylene glycolNo ChangeNo ChangeLiSIPA20Diethylene glycolNot CleanCleanEGSIPA20ethylene glycolNo ChangeCleandiesterDESIPA20Diethylene glycolNot CleanCleandiesterethyl ether

The data in Table 6 indicates compositions of ethylene glycol, diethylene glycol and diethylene glycol ethers containing lower molecular weight monomeric salts of 5-sulfosulfonic acid and related esters perform we...

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Abstract

Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims priority to U.S. patent application Ser. No. 12 / 413,085, filed Mar. 27, 2009, and U.S. patent application Ser. No. 12 / 715,978 filed Mar. 2, 2010 which claims benefit of U.S. Provisional Patent Application No. 61 / 164,195 filed Mar. 27, 2009, the disclosures of which are incorporated herein by reference in their entirety.FIELD OF THE DISCLOSURE[0002]The present disclosure relates generally to the removal of organic or inorganic substances from a substrate. In particular, the present disclosure relates to the removal of organic substances from a substrate. More particularly, the present disclosure relates to processes and associated apparatus which can be used with a range of compositions, for the removal of organic substances, for example, both amorphous and thermoset polymers from a substrate, for example, electronic devices including, but not limited to, semiconductor wafers, flat panel displays (FPDs), and other m...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G03F7/30
CPCG03F7/426H01L21/02057H01L21/31133G03F7/425C11D7/34C11D11/00G03F7/42H01L21/3213G03F7/422
Inventor QUILLEN, MICHAEL WAYNEO'DELL, DALE EDWARDLEE, ZACHARY PHILIPMOORE, JOHN CLEAONMCENTIRE, EDWARD ENNSHOCHSTETLER, SPENCER ERICHPETERS, RICHARD DALTONARMENTROUT, RODNEY SCOTTMUCK, DARRYL W.
Owner VERSUM MATERIALS US LLC