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Rigid circuit board with flexibly attached module

a flexible, circuit board technology, applied in the direction of fixed connections, electric apparatus casings/cabinets/drawers, instruments, etc., can solve the problems of cost and reliability of this approach, and achieve the effects of reducing size and complexity, high reliability, and cost saving

Inactive Publication Date: 2014-04-17
MICROELECTRONICS ASSEMBLY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a flexible circuit board that can be connected to a motherboard or clamping connector with ease. The flexible circuit board has bifurcated extensions along one edge with electrode pads that align with contacts on the motherboard or clamping connector to create a secure connection. This allows for the transfer of electrical signals between the motherboard and the flexible circuit board. The invention also includes a method for connecting the flexible circuit board to the motherboard or clamping connector. Additionally, the patent describes an electronic subsystem that includes a rigid circuit board and flexible circuit leads that align with contacts on the motherboard or clamping connector for secure and flexible connection. The technical effect of the invention is creating a reliable and flexible connection between a rigid circuit board and a flexible circuit board or clamping connector.

Problems solved by technology

As the number of lines increases, and the pitch becomes correspondingly smaller, both the cost and reliability of this approach can suffer.

Method used

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  • Rigid circuit board with flexibly attached module
  • Rigid circuit board with flexibly attached module
  • Rigid circuit board with flexibly attached module

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[0083]The inventive circuit is preferably manufactured as follows. First, two individual flexible circuit plies or laminates having conductive traces (typically on both surfaces) and vias connecting one surface to the other and one ply to another as needed, are formed by conventional means and bonded together over most of their surface area to form a multilayer flex panel or circuit board, leaving an unbonded strip (bifurcation) along one edge. The electrode pads intended to connect this circuit to a motherboard are located on the inner surfaces of the bifurcation. Next, the flex circuit is populated by microelectronic devices, which may be any combination of analog, digital, or mixed-mode semiconductor devices or passive components. This step will typically involve conventional “pick and place” assembly using solder or conductive adhesives as are known in the art. Then, the two legs of the bifurcated extensions or area are spread apart and the electrode pads are aligned with rows o...

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Abstract

An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is related to the following U.S. patent applications, filed on even date herewith by the present inventors: Docket No. MAT-20A, entitled “Flexible circuit board and connection system”; Docket No. MAT-20C, entitled “Method for making an electrical circuit”; Docket No. MAT-20D entitled “Electronic module with heat spreading enclosure”; Docket No. MAT-20E entitled “Electronic interconnect system”; Docket No. MAT-20F entitled “Pierced flexible circuit and compression joint”; and Docket No. MAT-20G entitled “Compression connector system.” The entire disclosures of each of the foregoing are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates generally to means for connecting microelectronic devices and systems. More particularly, the invention relates to improved flex-circuit based interconnect solutions for electronic circuits.[0004]2. Description of Re...

Claims

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Application Information

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IPC IPC(8): H05K1/00G06F1/16
CPCG06F1/184G06F1/185H05K1/118H05K1/147H05K3/366H05K2201/046H05K2201/09481H05K2201/10159H05K2201/10189H05K2201/10409H05K2201/10545H01R12/62G06F1/16H05K1/028H05K1/181
Inventor CLAYTON, JAMES E.FATHI, ZAKARYAE
Owner MICROELECTRONICS ASSEMBLY TECH
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