Laser sintering powder, method for producing structure, apparatus for producing structure

Inactive Publication Date: 2015-04-16
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0034]According to this application example, a possibility that the roller carelessly scrapes off the powder layer is low, and therefore, the powder layer is easily crushed to

Problems solved by technology

Unfortunately, fine metal powder is easily stirred up in the air.
Thus, although a minute structure can be obtained by laser sintering, the minute

Method used

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  • Laser sintering powder, method for producing structure, apparatus for producing structure
  • Laser sintering powder, method for producing structure, apparatus for producing structure
  • Laser sintering powder, method for producing structure, apparatus for producing structure

Examples

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second embodiment

[0110]Next, a second embodiment of the method for producing a structure according to the invention will be described.

[0111]Hereinafter, a second embodiment will be described, however, in the following description, different points from the first embodiment will be mainly described, and the description of the same matter will be omitted. Further, in the drawings, the same components as in the above-described embodiment will be given the same reference numerals.

[0112]FIGS. 8A to 8F and FIGS. 9A to 9E are schematic views for explaining a method for forming a structure using a laser sintering powder (a second embodiment of the method for producing a structure according to the invention), respectively. Hereinafter, with reference to FIGS. 8A to 8F and FIGS. 9A to 9E, the method for forming a structure will be described. In this method, a laser sintering apparatus 25 (a second embodiment of the apparatus for producing a structure according to the invention) shown in FIG. 7 is used.

[0113]F...

third embodiment

[0133]Next, a third embodiment of the method for producing a structure according to the invention will be described.

[0134]Hereinafter, a third embodiment will be described, however, in the following description, different points from the second embodiment will be mainly described, and the description of the same matter will be omitted. Further, in the drawings, the same components as in the above-described embodiments will be given the same reference numerals.

[0135]FIGS. 10A to 10F and FIGS. 11A to 11E are schematic views for explaining a method for forming a structure using a laser sintering powder (a third embodiment of the method for producing a structure according to the invention), respectively. Hereinafter, with reference to FIGS. 10A to 10F and FIGS. 11A to 11E, the method for forming a structure will be described. Also in this method, the laser sintering apparatus 25 shown in FIG. 7 is used.

[0136]The third embodiment is the same as the second embodiment except that the timin...

modification example 1

[0179]In the embodiments described above, the powder layer 1a is sintered by irradiating the powder layer 1a with the laser light 4. However, the sintered layer 1b may be further heated. By doing this, a structure 49 having high peeling resistance strength can be obtained.

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Abstract

A laser sintering powder to be sintered by irradiation with a laser light is provided. The sintering powder includes a plurality of metal particles and a binder which binds the metal particles to one another. The binder is sublimated by the irradiation with the laser light. The average particle diameter of the metal particles is 5 μm or more and 10 μm or less, and the average particle diameter of the laser sintering powder is 30 μm or more and 50 μm or less. Further, after a powder layer is formed using the laser sintering powder, this powder layer may be compressed in the thickness direction before or after irradiation with the laser light.

Description

BACKGROUND[0001]1. Technical Field[0002]The present invention relates to a laser sintering powder, a method for producing a structure, and an apparatus for producing a structure.[0003]2. Related Art[0004]A production method for forming a structure by irradiating a metal powder with a laser light is known. This method is suitable for the production of small amounts of various structures because the structure is formed by controlling a laser light using a computer. One such production method is disclosed in JP-T-2001-504897. According to this method, first, a metal powder is spread on a flat plate. Subsequently, a leveling plate is moved along the surface of the metal powder layer to level the metal powder to a given uniform thickness. Subsequently, a protection gas is flowed over the metal powder layer to create a protection gas atmosphere. Subsequently, a laser light is formed into a beam and scanned across the metal powder layer to draw a given image. In a region irradiated with th...

Claims

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Application Information

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IPC IPC(8): B22F1/00B22F3/12B22F3/105B22F1/10
CPCB22F1/0059B22F3/1055B22F3/12B22F2003/1056B22F2301/15B22F2301/20B22F2998/10C22C1/0433C22C19/00C22C33/0285C22C19/07Y02P10/25B22F1/10B22F12/52B22F12/63B22F10/16B22F12/47B22F3/18
Inventor NAKAMURA, HIDEFUMIMAEDA, YU
Owner SEIKO EPSON CORP
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