Laser sintering powder, method for producing structure, apparatus for producing structure

US20150104346A1Inactive Publication Date: 2015-04-16SEIKO EPSON CORP
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
SEIKO EPSON CORP
Publication Date
2015-04-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

A laser sintering powder to be sintered by irradiation with a laser light is provided. The sintering powder includes a plurality of metal particles and a binder which binds the metal particles to one another. The binder is sublimated by the irradiation with the laser light. The average particle diameter of the metal particles is 5 μm or more and 10 μm or less, and the average particle diameter of the laser sintering powder is 30 μm or more and 50 μm or less. Further, after a powder layer is formed using the laser sintering powder, this powder layer may be compressed in the thickness direction before or after irradiation with the laser light.
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Description

BACKGROUND

[0001] 1. Technical Field

[0002] The present invention relates to a laser sintering powder, a method for producing a structure, and an apparatus for producing a structure.

[0003] 2. Related Art

[0004] A production method for forming a structure by irradiating a metal powder with a laser light is known. This method is suitable for the production of small amounts of various structures because the structure is formed by controlling a laser light using a computer. One such production method is disclosed in JP-T-2001-504897. According to this method, first, a metal powder is spread on a flat plate. Subsequently, a leveling plate is moved along the surface of the metal powder layer to level the metal powder to a given uniform thickness. Subsequently, a protection gas is flowed over the metal powder layer to create a protection gas atmosphere. Subsequently, a laser light is formed into a beam and scanned across the metal powder layer to draw a given image. In a region irradiated with th...

Claims

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