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Thermosyphon heat sink

a heat sink and heat sink technology, applied in the field of heat dissipation devices, can solve the problems of slow circulation speed of liquid and gas, large amount of heat generated by electronic components or semiconductors of electronic products or optoelectronic products during operation, and inability to operate, so as to improve the heat dissipation effect of the heat sink, and improve the effect of cooling the circulation of liquid and gas

Inactive Publication Date: 2015-05-14
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent invention has the benefit of separating liquids and gases in a heat sink system. This reduces the impact of gas on liquids and reduces flow resistance, resulting in improved heat dissipation. The design also allows for simultaneous cooling of multiple heating elements by arranging an auxiliary evaporating section and an evaporating section in a line or staggered manner. Additionally, a stepped area is formed to absorb heat generated from the heating element continuously. Overall, this invention improves the efficiency and effectiveness of heat sink systems.

Problems solved by technology

Generally speaking, electronic components or semiconductor of electronic products or optoelectronic products generate a large amount of heat during operation.
The electronic products or optoelectronic products will be out of function due to overheating.
(1) A path of gas flowing into the condenser from the evaporator through the gas tube and a path of gas flowing into the evaporator from the condenser are too long so that the fluid resistance is large and the circulation speed of the liquid and the gas is slow. As a result, the effect of heat dissipating is poor.
(2) The condenser is composed of a plurality of flat tubes, gas-gathering tubes and liquid gathering tubes so that the volume of the heat sink is large and the manufacturing process is complicated. As a result, the cost of the manufacturing process and the material will be increased.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0036]Please refer to FIG. 1 to FIG. 4 showing the heat-dissipating device of the present invention. The present invention provides a heat-dissipating device or thermosyphon heat sink 1 for contacting with a heating element. The heat-dissipating device 1 includes a condenser 10 and an evaporator 20.

[0037]As shown in FIGS. 1-3, the condenser 10 includes a shell 11, a main capillary wick 12 and a heat-dissipating body 13. The shell 11 has a chamber 111 and a through hole 112. The through hole 112 communicating with the chamber 111 is provided at one side of the shell 11. The main capillary wick 12 is disposed in the chamber 111. The main capillary wick 12 can be a metal net or a plurality of heat-dissipating fins, or disposed on an inner surface of the chamber 111 by sintering of metal powder or sand blasting. Alternatively, the main capillary wick 12 can be disposed at the inner wall of the chamber 111 and constituted by a foam material. Moreover, the main capillary wick 12 can also ...

second embodiment

[0052]Please refer to FIG. 9 to FIG. 11 showing the heat-dissipating device of the present invention. The heat-dissipating device 1a includes a condenser 10a and an evaporator 20a. The condenser 10a includes a shell 11a, a main capillary wick 12a and a heat-dissipating body 13a. The shell 11a has a chamber 111a and a through hole 112a. The evaporator 20a includes an evaporating section 21a, a gas conduit 22a, a liquid conduit 23a, a working fluid and an auxiliary capillary wick 25a.

[0053]A difference between the present embodiment and the first embodiment is that the condenser 10a in the present embodiment further includes a couple of lids 113a. A couple of entrances 110a communicating with the chamber 111a are disposed at the left end and right end of the shell 11a. Each lid 113a covers and seals the entrance 110a of the shell 11a. The shell 11a can be formed by extruding for simplifying the manufacturing process and saving the cost of the shell 11a.

[0054]Moreover, another differ...

third embodiment

[0059]Please also refer to FIG. 14 to FIG. 17 showing the heat-dissipating device of the present invention. The condenser 10d includes a shell 11d and a main capillary wick 12d. The shell 11d has a chamber 111d and a through hole 112d communicating with the chamber 111d at a side of the shell 11d. The main capillary wick 12d is disposed in the chamber 111d. As shown in FIG. 15 and FIG. 16, the main capillary wick 12d includes a plurality of fins protruded from a top inner surface of the chamber 111d to the bottom of an inner surface of the chamber 111d.

[0060]As shown in FIG. 17, the evaporator 20d includes an evaporating section 21d with a gas cavity 211d, a gas conduit 22d communicating with the through hole 112d, and a liquid conduit 23d communicating with the chamber 111d and filling with liquid. The liquid conduit 23d is inserted in the gas conduit 22d and has a hole 231d communicating with the gas cavity 211d. An outer surface of the evaporating section 21d is contacted with t...

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PUM

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Abstract

A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention generally relates to a heat-dissipating device and, in particular to a thermosyphon heat sink.[0003]2. Description of Prior Art[0004]Generally speaking, electronic components or semiconductor of electronic products or optoelectronic products generate a large amount of heat during operation. The electronic components or semiconductor should be prevented from overheating and causing damages to electronic products or optoelectronic products. The electronic products or optoelectronic products will be out of function due to overheating. Thus heat dissipating devices are usually used for cooling electronic components or semiconductor of electronic products or optoelectronic products.[0005]Taking Taiwanese patent No. 1339331 as an example, the conventional thermosyphon heat sink includes an evaporator, a condenser, a gas tube, a liquid tube and a working fluid. Two ends of the gas tube are connected with ...

Claims

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Application Information

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IPC IPC(8): F28D15/02
CPCF28D15/02H01L2924/0002F28D15/04F28D15/046H01L2924/00
Inventor HUANG, YU-HUNGTAN, LI-KUANGWU, WEI-FANG
Owner DELTA ELECTRONICS INC