Unlock instant, AI-driven research and patent intelligence for your innovation.

Methods and apparatus for generating a modulated waveform

a modulated waveform and waveform technology, applied in the direction of electrical apparatus, multiple-port active network, automatic control, etc., can solve the problems of clock speed operation, generating modulated, and affecting the operation of microcontrollers

Active Publication Date: 2015-09-10
NXP USA INC
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a problem in generating high-frequency modulated waveform signals with a high degree of frequency resolution and low power consumption. Current microcontrollers have limitations in generating such signals due to the need for slower clock speeds and lower-cost components. To address this problem, the patent proposes a method and apparatus for generating a modulated waveform signal using a semiconductor device that includes an on-chip timer and PWM module. The invention provides a solution that allows for higher frequency modulation with a high resolution while keeping costs and power consumption down. The invention also avoids the need for external components and improves reliability and dynamic response of the system.

Problems solved by technology

However, a problem with existing microcontroller architectures is that such restrictions on the operating clock speeds have the detrimental effect on the microcontrollers in that they are incapable of generating modulated signal waveforms comprising high enough frequencies, whilst also providing high enough frequency resolution for minimizing output voltage ripple and, thus, also noise levels, as required for switched mode power supplies utilized in the telecommunication industry.
As will be appreciated, for existing applications where a frequency resolution of 11 to 14 bits is required for up to a 1000 kHz waveform, these current on-chip timers and PWM modules are inadequate.
A problem with this approach is that there is a need to use external components to refine the on-chip generated modulated waveform.
Thus, the chain of components and the characteristics of such a semiconductor device result in reduced reliability, increased system costs and worse dynamic response in comparison to fully integrated systems.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Methods and apparatus for generating a modulated waveform
  • Methods and apparatus for generating a modulated waveform
  • Methods and apparatus for generating a modulated waveform

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015]In the following disclosure, examples will be described in terms of a system-on-chip (SoC) microcontroller comprising integrated timer logic and delay logic. Although examples of the invention will be described in terms of such a system-on-chip (SoC) microcontroller, it will be appreciated that the inventive concept herein described may be embodied in any apparatus that incorporates timer logic and delay logic arranged to generate a modulated waveform signal.

[0016]Referring now to FIG. 2, there is illustrated an example of a semiconductor device 200 adapted according to some embodiments of the invention, which for the illustrated example comprises a system-on-chip (SoC) signal processing logic in the form of a microcontroller. The semiconductor device 200 further comprises timer logic 210 for generating a first modulated waveform signal (MWrough) 215 and delay logic 220, operably coupled to the timer logic 210 and arranged to generate a second, refined modulated waveform signa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A system and method are present for generating a modulated waveform. A timer is configured to generate a first modulated waveform signal, and an adder module is configured to calculate a delay. The delay includes at least one of an edge fractional delay and a dead time fractional delay. A delay module is operably coupled to the timer and the adder module. The delay module is configured to delay at least one of a rising edge of the first modulated waveform signal and a falling edge of the first modulated waveform signal by the delay to generate a second modulated waveform signal that has a higher frequency resolution than a frequency resolution of the first modulated waveform signal.

Description

FIELD OF THE INVENTION[0001]The field of this invention relates to a method and apparatus for generating a modulated waveform signal.BACKGROUND OF THE INVENTION[0002]It is known for microcontrollers and the like to be used to drive, by way of example, switch mode power supplies, resonant converters, induction heaters, etc, whereby the microcontroller is required to generate a high frequency modulated signal waveform. Such modulated waveform signals are required to comprise a precise frequency resolution, for example in the range of 11 to 14 bits resolution at a frequency of approximately 100 Kilohertz (Khz) to 1 megahertz (Mhz). In addition, suitable microcontrollers are typically required to be highly integrated, in order to provide reliable and low-cost solutions, whilst also being flexible in their operation and architecture.[0003]In order to keep both costs and power consumption down to acceptable levels, semiconductor devices comprising microcontrollers are often required to us...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H03K5/159H03L7/08H03K7/08
CPCH03K5/159H03L7/08H03K7/08H03L7/0814
Inventor LANCASTER, MARK A.WU, CHONGLI
Owner NXP USA INC