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Thermally expandable resin composition

Active Publication Date: 2015-10-08
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is about a thermally expandable resin composition that can be used to make molded objects that have good fire resistance, low elastic modulus, and can withstand high levels of stress after thermal expansion. The composition includes a specific type of epoxy resin called brominated epoxy compound. This compound is made by reacting a brominated bisphenol compound with epichlorohydrin. The resulting epoxy resin has low viscosity and can be easily processed. The use of this specific epoxy resin composition can improve the performance and reliability of molded objects made from the composition.

Problems solved by technology

However, molded bodies obtained from these epoxy resin-containing thermally expandable resin composition become hard and fragile.
Therefore, if impact is provided, molded bodies of these epoxy resin-containing thermally expandable are relatively easily broken or cracked in some cases.
The problem that molded bodies of these epoxy resin-containing thermally expandable are relatively easily broken or cracked in some cases increases when used in the environment of low temperature such as a cold district, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0163][(Z) A Combination of Said Brominated Epoxy Epoxy Compound and at Least One of a Bisphenol-Type Epoxy Compound and an Aliphatic Epoxy Compound]

[0164](X is a repeating unit ranging from 1 to 100.)

[0165]10.9 parts by weight of tetrabromobisphenol-A-diglycidyl-ether (available from Nippon Steel Chemical Co., Ltd., trade name: YDB-400, an epoxy equivalent: 403.1 g / eq. Hereinafter referred to as “A-10”.) as the (Z-1),

[0166]45.4 parts by weight of bisphenol-F-diglycidyl-ether (available from Mitsubishi Chemical Corporation, trade name: E807, an epoxy equivalent: 168 g / eq. Hereinafter referred to as “A-1”.) as the (Z-3),

[0167]43.7 parts by weight of an amino compound which is prepared by mixing 3-lauryloxypropyl-1-amine with hexamethylenediamine derivative (available from Mitsubishi Chemical Corporation, trade name: FL052) at a weight ratio of 6:4 (an amine equivalent: 167.3 g / eq., on the basis of the active hydrogen. Hereinafter referred to as “B-1”.), as an epoxy curing agent, 90 p...

example 2

[0186]In the case of Example 1, 11.2 parts by weight of “A-10” are used, 39.3 parts by weight of “A-1” are used. Also, in addition to “A-10” and “A-1”, the (Z-6) is used.

[0187](R7 is an alkylene group having 1 to 20 carbon atoms, alkenylene group having 1 to 20 carbon atoms or arylene group having 1 to 20 carbon atoms.)

[0188]As the (Z-6), 4.7 parts by weight of dimer-modified epoxy (an epoxy equivalent: 422 g / eq. Hereinafter referred to as “A-3”.) are used.

[0189]Also, 43.9 parts by weight of “B-1” are used. The formulation used in Example 2 and the results are shown in Table 1.

example 3

[0190]In the case of Example 1, 31.6 parts by weight of “A-10” are used; the (Z-5) is used instead of “A-1”.

[0191]As the (Z-5), 31.5 parts by weight of hexamethylene diglycidyl ether (an epoxy equivalent: 157 g / eq. Hereinafter referred to as “A-2”.)

[0192]Also, completely the same experiment as in Example 1 is carried out, except that 36.9 parts by weight of “B-1” are used.

[0193]The formulation used in Example 3 and the results are shown in Table 1.

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Abstract

A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy compound contained in said epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and / or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and / or aliphatic epoxy compound is in the range 99:1-1:99.

Description

TECHNICAL FIELD[0001]The present invention relates to an thermally expandable resin composition, more specifically, to an thermally expandable resin composition for the use of refractory coating materials for pillars, beams and walls, etc., the use of fireproof sashes, the use of fireproof compartment passage structures and the use of fireproof doors, etc.BACKGROUND ART[0002]Materials for a structure such as a building and a ship, etc. are required to have fire resistance which doesn't easily catch fire, etc. As an thermally expandable resin composition to be used for the use which is required to have fire resistance, it has been proposed an thermally expandable resin composition which forms an expansion residue and prevents spread of a flame, smoke, etc., of a fire, etc., when it is exposed to heat of a fire, etc.[0003]More specifically, as the first thermally expandable resin composition, it has been proposed a thermally expandable resin composition, which does not contain a halog...

Claims

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Application Information

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IPC IPC(8): C08J9/00C08K3/26C08G59/50C08K3/32C08K3/04C08G59/22
CPCC08J9/0066C08K3/04C08G59/226C08G59/504C08K2003/265C08K3/26C08J2363/02C08K2003/323C08K3/32C08G59/308C08K5/34928C08L2205/02C08L2205/03C08L63/00C08K3/22C08K2003/2241
Inventor YOSHITAKE, TOSHITAKATONO, MASAKIOTSUKA, KENJIYANO, HIDEAKI
Owner SEKISUI CHEM CO LTD
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