System and method for panelized, superinsulated building envelopes

Abstract

Panelized wall and roof structures for constructing energy efficient buildings. The panelized structures have a structural layer with insulation, an airtight layer providing a primary air barrier and a vapor retarder exterior to the structural layer, a vapor open blanket layer including insulation and attached to the structural layer via structural screws, a weather resistant barrier provided exterior to the blanket layer and including an airtight, water-repelling, vapor-open fabric, and a rain screen provided exterior to the weather resistant barrier and including a drainage plane for channeling moisture away from the weather resistant barrier.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present invention claims priority to U.S. Provisional Application Ser. No. 62 / 197,931 filed on 28 Jul. 2015 and herein incorporated by reference in its entirety.FIELD OF THE INVENTION[0002]The present invention relates to the field of construction of energy efficient buildings. Moreover, the present invention relates to panelized, superinsulated building systems and methods.BACKGROUND OF THE INVENTION[0003]In the design and construction of buildings, it is well known that energy efficiency and building insulation go hand in hand. Accordingly, numerous types of insulation systems and methods exist. Within typical “stick built” construction using framed lumber, voids are created within walls. In such exterior walls, these voids are often filled with fiberglass, cellulose-based, or foam material which have varied insulative value. Vapor barriers are typically added to such exterior walls in order to enhance the insulative effect. However...

AI Technical Summary

Benefits of technology

The present invention is a system and method for building envelopes that reduces problems in construction such as heat transfer, thermal bridging, and leakage. It also helps in reducing problems related to moisture and mold, and provides better insulation. The invention uses specific assemblies and is performed in a controlled environment, making it easy to install. It can be used in building new homes or commercial structures, and is cost-effective. Overall, the invention enables the construction of low-energy, high-performance buildings in any location.

Problems solved by technology

However, due to the nature of such framed lumber, thermal bridging often detrimentally occurs to facilitate heat transfer within walls.

As well, a variety of leakage points exist due to difficulties inherent to current vapor barrier technology.

Disadvantageously however, standard SIP technology typically requires spline joints which connect the panels together while allowing thermal bridging to occur.

The assemblies that will perform best from energy and resiliency viewpoints are inherently complex, time-consuming to assemble, and require specialized training to execute effectively.

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