Methods and apparatuses for determining a parameter of a die

Abstract

Embodiments of the present disclosure provide techniques and configurations for integrally determining a parameter (e.g., temperature) of a die of an integrated circuit. In one instance, the apparatus may comprise a die including a first (e.g., remote) area and a second (e.g., local) area disposed at a distance from the first area, and circuitry to determine a parameter associated with the remote area of the die. The circuitry may include: a first sensing device disposed in the remote area, to provide first readings associated with the parameter; a second sensing device disposed in the local area, to provide second readings associated with the parameter; and a control module coupled with the sensing devices and disposed in the local area, to facilitate a determination of the parameter based on the first and second readings provided by the first and second sensing devices. Other embodiments may be described and / or claimed.

Description

FIELD[0001]Embodiments of the present disclosure generally relate to the field of sensor-equipped devices, and more particularly, to techniques for onboard or integral determining of parameters of a die in integrated circuits.BACKGROUND[0002]Digital temperature sensor circuit systems (DTS) are used in many integrated circuit products to provide the temperature information of the die (e.g., silicon die) to be used for system optimization or damage protection. Typically, several DTS may be placed in a single die to detect the temperature information from different locations in the multi-core and multi-standard products in order to perform optimization and protection for individual core or system in parallel. However, the form factor of the DTS makes it difficult for it to be placed in the device-dense core area of the die, which may contain central processing unit (CPU) circuitry, for example. The concept of remote sensing was, therefore, proposed and implemented to reduce the silicon...

AI Technical Summary

Benefits of technology

The present patent relates to techniques for onboard or integral determination of parameters of a die in integrated circuits. The patent proposes a method for using sensing devices in the remote or device-dense areas of a die to provide temperature information. However, current remote sensing solutions may require substantial space in the remote area and may consume substantial space in the input-output area of the integrated circuit. The patent proposes a solution to address this issue by incorporating a control module in the local area of the die to facilitate the determination of parameters associated with the remote area of the die. The technical effect of the patent is to provide a more efficient and space-saving solution for onboard or integral determination of parameters of a die in integrated circuits.

Problems solved by technology

However, the form factor of the DTS makes it difficult for it to be placed in the device-dense core area of the die, which may contain central processing unit (CPU) circuitry, for example.

However, the dimensions of temperature sensing devices may require substantial use of space in the remote area of the die.

These routings may also consume substantial space in the die.

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