Cooling mechanism of high mounting flexibility

Abstract

A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a Divisional of co-pending application Ser. No. 14 / 675,059 filed on Mar. 31, 2015 for which priority is claimed under 35 U.S.C. §120, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to hard disk drive technology and more particularly, to a cooling mechanism of high mounting flexibility, which provides a margin between each heat pipe and each respective position-limit sliding groove that accommodates the respective heat pipe for enabling the hot interfaces of multiple heat pipes to be positioned in one heat transfer block in reversed directions so that the cold interfaces of the heat pipes can be extended to different peripheral sides of the heat sink to enhance the overall heat dissipation efficiency.[0004]2. Description of the Related Art[0005]Following fast development of technology, advanced computers, not...

AI Technical Summary

Benefits of technology

The present invention provides a cooling mechanism with high mounting flexibility. It includes a heat sink, at least one heat transfer block, and at least one elastic member. The heat sink has position-limit sliding grooves for accommodating heat pipes, and the heat transfer block has a recessed insertion passage and a planar contact surface for the heat source. The elastic member is positioned between the heat sink and the heat transfer block and can adjust its position to reduce thermal resistance. The elastic member can also have an abutment shrapnel for tight contact with the heat pipes. The heat sink body has recessed positioning grooves, and the elastic member has elastic thermal pads positioned in the recessed positioning grooves for quick transfer of heat. The invention enhances heat dissipation efficiency and provides flexibility in mounting the cooling mechanism.

Problems solved by technology

However, increasing the operating speed of a computer or notebook will lead to an increase in the amount of latent heat produced by the CPU, imaging processor or other active component parts of the motherboard.

However, the thickness of the applied heat transfer medium affects the thermal resistance.

However, because each heat pipe A2 has one end A21 thereof bonded to one end of one respective locating groove A11 and an opposite end thereof extended to one respective opening A12, thus, the opposite ends of the heat pipes A2 can simply be arranged in one direction in a parallel manner and bonded to the respective metal blocks A3, i.e., the heat pipes A2 cannot be symmetrically arranged at two opposite sides relative to the metal blocks A3 to let the opposite ends thereof be extended to all different peripheral sides of the heat sink base A1, restricting the use of space and limiting the cooling performance.

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