Integrated circuit having improved electromigration performance and method of forming same

Abstract

An aspect of the disclosure is directed to a method of forming an interconnect for use in an integrated circuit. The method comprises: forming an opening in a dielectric layer on a substrate; filling the opening with a metal such that an overburden outside of the opening is created; subjecting the metal to a microwave energy dose such that atoms from the overburden migrate to within the opening; and planarizing the metal to a top surface of the opening to remove the overburden, thereby forming the interconnect.

Description

BACKGROUND[0001]Technical Field[0002]The present disclosure relates to integrated circuits, and more particularly, to integrated circuits having an improved electromigration performance and a metal with an increased grain size, and a method of forming the same.[0003]Related Art[0004]Integrated circuit interconnects, and particularly, high performance conductors are used for most types of advanced integrated circuits and are typically fabricated having thick metal wires such as copper (Cu) or aluminum (Al). Traditionally, the metal wires are formed using electrolytic plating processes in conjunction with photoresist masking and stripping, and removing a seed layer later on. In damascene processes, metal interconnect lines are delineated and isolated in dielectrics by means of chemical mechanical polishing (CMP). A dual damascene process is a similar process in which metal interconnect lines and vias (i.e., conductor-filled channels) are defined independently in photolithography and e...

AI Technical Summary

Problems solved by technology

Conventional annealing at temperatures higher than about 100° C. results in faster grain growth and, consequently, larger grains but leads to forming voids within the entire interconnect structure.

However, any metal void formed within the interconnect structure drastically degrades durability and reliability of interconnects.

As metal atoms spread to the exterior of the metal due to electromigration, the resulting tensile stresses in the metal cause voids to be created within the metal, resulting in interconnect and / or chip failures.

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