Heat spreader with a liquid-vapor separation structure

Inactive Publication Date: 2017-12-07
TAI SOL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005]The present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide a heat spreader with a liquid-vapor separation structure, which has multiple vapor passages and at least one liqui

Problems solved by technology

The flowing of the liquid phase and vapor phase of the working fluid in different directions may also cause a reduction in the mass flux during thermal cycling, further affecting the cooling effect.
Further, because the support projections of the aforesaid prior art heat transfer respectively consist of two solid semi-spheres of unequal radiu

Method used

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  • Heat spreader with a liquid-vapor separation structure
  • Heat spreader with a liquid-vapor separation structure
  • Heat spreader with a liquid-vapor separation structure

Examples

Experimental program
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Example

[0031]After understanding the structural details of this first embodiment of the present invention, the application of this first embodiment is explained hereinafter.

[0032]As illustrated in FIGS. 1-4, when the heat spreader 10 is at work, the heat-absorbing zone H transfers heat energy to the accommodation chamber 121, causing the working fluid in the two pieces of first wick material 14 to be vaporized into vapor phase. The working fluid will then go through the multiple vapor passages 141 in between the multiple spacer members 13 in the form of vapor phase, and then diffuses into the condensing zone C. When reached the condensing zone C, the working fluid can be reduced to liquid phase and adhered to the condensing zone C, and then guided by the two fiber tows of the first wick material 14 through the two liquid passages 142 between the condensing zone C and the heat-absorbing zone H to flow back to the heat-absorbing zone H. The multiple vapor passages 141 and the two liquid pass...

Example

[0035]Referring to FIG. 5, a heat spreader 20 in accordance with a second embodiment of the present invention is shown. This second embodiment is substantially similar to the aforesaid first embodiment with the exceptions as follows:

[0036]The second panel 22 has a second wick material 28 sintered thereto. This second wick material 28 can be disposed in the second panel 22 within the heat-absorbing zone H2 and / or the condensing zone C2. In this second embodiment, the two pieces of first wick material 24 are disposed in contact with the second wick material 28.

[0037]The second wick material 28 can be selected from copper powder or copper mesh. In this second embodiment, the second wick material 28 is a copper mesh.

[0038]In this second embodiment, a respective certain area of the second wick material 28 is respectively sintered to the heat-absorbing zone H2 and the condensing zone C2 in the second panel 22 of the heat spreader 20, enabling the heat-absorbing zone H2 to have a relativel...

Example

[0039]Referring to FIGS. 6-8, a heat spreader 30 in accordance with a third embodiment of the present invention is shown. This third embodiment is substantially similar to the aforesaid first embodiment with the exceptions as follows:

[0040]The second panel 32 further comprises at least one recessed portion 322 located in the condensing zone C3. In this third embodiment, the number of the at least one recessed portion 322 is 2; the second panel 32 further has a third wick material 38 sintered thereto and located at a bottom side of each of the two recessed portion 322. Further, the third wick material 38 is connected with the first wick material 34. Further, the height of the two recessed portions 322 is greater than the height from the at least one first panel 31 to the second panel 32 (see FIG. 8). In this third embodiment, the number of the at least one first panel 31 is 2. These two first panels 31 are bonded to the second panel 32. Further, two enclosed accommodation chambers 32...

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Abstract

A heat spreader with a liquid-vapor separation structure includes a first panel, a second panel bonded with the first panel and defining therebetween an enclosed accommodation chamber, multiple spacer members arranged spaced apart from one another in the accommodation chamber and abutted between the first panel and the second panel and defining multiple vapor passages and liquid passages therebetween and dividing the accommodation chamber into a heat-absorbing zone and a condensing zone that are disposed in communication with each other through the vapor passages and the liquid passages, a first wick material partially disposed in the liquid passages and partially disposed in the heat-absorbing zone and the condensing zone, and a working fluid filled in the accommodation chamber.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]The present invention relates to cooling technology and more particularly, to a heat spreader with a liquid-vapor separation structure.2. Description of the Related Art[0002]With the continuous growing trend of global electronics industry market, many electronic products (such as LED light module, computers and mobile phones, etc . . . ) have become an indispensable part of people's lives. However, with continuous development of these electronic products, in order to achieve enhanced product performance, the product composition units are easy to produce large amounts of heat during operation. When these product composition units have a certain degree of waste heat accumulated therein, the working efficiency of these electronic products will be lowered, or the lifespan of these electronic products will be shortened. Therefore, most electronic products have heat pipes or heat spreaders (vapor chambers) mounted in their heat-gen...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28D15/04F28F9/007F28D21/00
CPCF28D15/0266F28D2021/0028F28F9/0075F28D15/046F28D15/0233H01L23/427
Inventor YEH, YUN-YEUTSENG, CHUAN-CHICUI, MING-QUAN
Owner TAI SOL ELECTRONICS
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