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Heat spreader with a liquid-vapor separation structure

Inactive Publication Date: 2017-12-07
TAI SOL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a heat spreader with a liquid-vapor separation structure that increases the mass flux of the working fluid in the vapor-liquid circulation system to achieve better heat dissipation performance. There are multiple vapor passages and at least one liquid passage arranged inside the heat spreader to separate the vapor and liquid phases of the working fluid. The heat spreader also has multiple spacer members arranged therein and abutted between at least one first panel and a second panel to form a strong support structure. This arrangement achieves better supporting effect compared to the prior art design. Overall, the invention improves heat dissipation performance and efficiency of the working fluid cycle.

Problems solved by technology

The flowing of the liquid phase and vapor phase of the working fluid in different directions may also cause a reduction in the mass flux during thermal cycling, further affecting the cooling effect.
Further, because the support projections of the aforesaid prior art heat transfer respectively consist of two solid semi-spheres of unequal radius and arranged spaced away from one another, if the heat spreader is mounted in a space that needs to bear a load or tends to be compressed, the stress point will be focused on the top side of the semi-spheres, thus, if the heat spreader is compressed, the pressure cannot be evenly distributed in all directions, leading to structural damage.

Method used

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Examples

Experimental program
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first embodiment

[0026]Referring to FIGS. 1-4, a heat spreader with a liquid-vapor separation structure in accordance with the present invention is shown. The heat spreader 10 comprises at least one first panel 11, a second panel 12, a plurality of spacer members 13, at least one piece of first wick material 14 and a working fluid (not shown).

[0027]The at least one first panel 11 is bonded to the second panel 12. In this first embodiment, the number of the at least one first panel 11 is 1. Further, the first panel 11 and the second panel 12 define therebetween at least one enclosed accommodation chamber 121. In this first embodiment, the number of the at least one accommodation chamber 121 is 1. Further, at least one vapor discharge tube 19 is disposed in the connection area between the first panel 11 and the second panel 12. In this first embodiment, the number of the at least one vapor discharge tube 19 is 1. The vapor discharge tube 19 has one end thereof disposed in communication with the accomm...

second embodiment

[0036]The second panel 22 has a second wick material 28 sintered thereto. This second wick material 28 can be disposed in the second panel 22 within the heat-absorbing zone H2 and / or the condensing zone C2. In this second embodiment, the two pieces of first wick material 24 are disposed in contact with the second wick material 28.

[0037]The second wick material 28 can be selected from copper powder or copper mesh. In this second embodiment, the second wick material 28 is a copper mesh.

[0038]In this second embodiment, a respective certain area of the second wick material 28 is respectively sintered to the heat-absorbing zone H2 and the condensing zone C2 in the second panel 22 of the heat spreader 20, enabling the heat-absorbing zone H2 to have a relatively higher working fluid carrying capacity. Further, the second wick material 28 effectively and evenly carries the working fluid, enhancing the evapotranspiration efficiency of the working fluid. Further, the arrangement of the second...

third embodiment

[0041]The third wick material 38 can be selected from copper powder or copper mesh. In this third embodiment, the third wick material 38 is made from copper mesh.

[0042]In this third embodiment, the added structure of the two recessed portions 322 of the heat spreader 30 increase the working fluid storage capacity of the condensing zone C3; the two pieces of first wick material 34 are used to guide the working fluid from the condensing zone C3 back to the heat-absorbing zone H3. Further, changing the number of the component parts of the heat spreader 30 can relatively changing the cooling efficiency. The other structural features of this third embodiment and the effect this third embodiment can achieve are same as the aforesaid first embodiment, and thus, it is unnecessary to repeat them here.

[0043]Referring to FIG. 9, a heat spreader 40 in accordance with a fourth embodiment of the present invention is shown. This fourth embodiment is substantially similar to the aforesaid first emb...

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Abstract

A heat spreader with a liquid-vapor separation structure includes a first panel, a second panel bonded with the first panel and defining therebetween an enclosed accommodation chamber, multiple spacer members arranged spaced apart from one another in the accommodation chamber and abutted between the first panel and the second panel and defining multiple vapor passages and liquid passages therebetween and dividing the accommodation chamber into a heat-absorbing zone and a condensing zone that are disposed in communication with each other through the vapor passages and the liquid passages, a first wick material partially disposed in the liquid passages and partially disposed in the heat-absorbing zone and the condensing zone, and a working fluid filled in the accommodation chamber.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]The present invention relates to cooling technology and more particularly, to a heat spreader with a liquid-vapor separation structure.2. Description of the Related Art[0002]With the continuous growing trend of global electronics industry market, many electronic products (such as LED light module, computers and mobile phones, etc . . . ) have become an indispensable part of people's lives. However, with continuous development of these electronic products, in order to achieve enhanced product performance, the product composition units are easy to produce large amounts of heat during operation. When these product composition units have a certain degree of waste heat accumulated therein, the working efficiency of these electronic products will be lowered, or the lifespan of these electronic products will be shortened. Therefore, most electronic products have heat pipes or heat spreaders (vapor chambers) mounted in their heat-gen...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28D15/04F28F9/007F28D21/00
CPCF28D15/0266F28D2021/0028F28F9/0075F28D15/046F28D15/0233H01L23/427
Inventor YEH, YUN-YEUTSENG, CHUAN-CHICUI, MING-QUAN
Owner TAI SOL ELECTRONICS
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