Method of determining curing conditions, method of producing circuit device, and circuit device
a technology of curing conditions and circuit devices, which is applied in the direction of printed circuit aspects, sustainable manufacturing/processing, final product manufacturing, etc., to achieve the effect of reducing the residual voids in the thermosetting resin
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first embodiment
1. First Embodiment
[0047](1) Method of producing a circuit device
[0048]FIG. 1 schematically shows a part of a production process of circuit devices according to an embodiment of the present disclosure. FIG. 2 is a flowchart showing the production process. In the following, the production process will be described in order referring to FIGS. 1 and 2.
[0049]As shown in FIG. 1A, an electronic component 11 and a mounting substrate 21 to mount the electronic component 11 are prepared. On the mounting substrate 21, electrodes 22 are provided. The electronic component 11 has some electrodes 12 and some solder parts (e.g., pre-coating solder bumps) 13 which are provided on the electrodes 12.
[0050]The mounting substrate 21 to have the components mounted thereon may typically be a rigid substrate, or it may be a flexible substrate. The electronic component 11 may be, for example, an integrated circuit (IC), or may be a flexible print circuit (FPC).
[0051]As shown in FIG. 1B, for example, a sold...
second embodiment
2. Second Embodiment
[0117]A method of producing a circuit device according to a second embodiment includes the above-described production process of circuit devices of the first embodiment. On that basis, this production method includes a process after the heat processing by the heating temperature of the curing degree curve that is used (first heating temperature); the process being a process of further heating the resin at a temperature that is lower than the first heating temperature (second heating temperature).
[0118]Specifically, in cases where the thermosetting resin is an epoxy resin, a range of the second heating temperature may be 100° C. or higher and 150° C. or lower. In this case, a range of the heating time may be set to 600 seconds or more and 1000 seconds or less. More desirably, the range of the heating time may be 700 seconds or more and 900 seconds or less.
[0119]By thus heating the resin at the second heating temperature slowly over time, after the void removal tim...
third embodiment
3. Third Embodiment
[0120]A method of producing a circuit device according to a third embodiment includes the above-described production process of circuit devices of the first embodiment. On that basis, in this production method of the third embodiment, the electronic component 31 is connected to the substrate by a method shown in FIGS. 10A to 10C.
[0121]Note that the electronic component 31 shown in FIGS. 10A to 10C is a flexible print circuit (FPC), but of course the electronic component 31 may be an integrated circuit as has been described in the first embodiment.
[0122]The FPC 31 has a base layer 34 made of a material such as polyimide, a metal wiring 36, a plurality of electrodes 32, and the like. As shown in FIG. 10A, the thermosetting resin R is provided above the electrode 22 on the mounting substrate 21 and on the solder part 23 on the electrode. In a state where an electrode arrangement surface 31a on which the electrodes 32 of the FPC 31 are disposed is angled with respect ...
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Abstract
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