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Configurable Cooling Assembly and Cooling Method

a cooling assembly and configurable technology, applied in the field of configurable cooling blocks, can solve the problems of limiting the effectiveness of cooling fans and making the challenge of preventing overheating of hsms more difficult, and achieve the effect of being easily configurabl

Inactive Publication Date: 2018-05-31
THE BOEING CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent is for a cooling system that prevents overheating of heat-sensitive materials near repair patches being cured on a composite skin by a heat source. The system uses thermally conductive cooling blocks made of metal that are placed on the composite skin to conduct heat away from the area near the repair patch. The cooling assembly is efficient, easy to install, reusable, and can be reconfigured for different heat-sinking needs. It does not interrupt the thermal curing process and ensures the safety of the adjacent heat-sensitive materials.

Problems solved by technology

In other applications, however, the distance between the edge of the heating blanket and the HSM may be relatively small, for example on the order of a few inches, limiting the effectiveness of cooling fans.
The challenge of preventing overheating of HSMs is made more difficult by complicated structural geometries and repair areas that are hard-to-reach.

Method used

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  • Configurable Cooling Assembly and Cooling Method
  • Configurable Cooling Assembly and Cooling Method
  • Configurable Cooling Assembly and Cooling Method

Examples

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Embodiment Construction

[0027]FIG. 1 illustrates a composite laminate structure such as a composite aircraft skin 20 having an area 22 (hereinafter “repair area”) requiring in-situ repair or rework in order to correct an out-of-specification condition such as impact damage. Although not shown in the Figures, the repair is carried out using a cured or uncured composite laminate patch that is bonded to the skin 20 using a bonding adhesive. A curing assembly (not shown) that includes a heating blanket 28, is used to thermally cure the bonding adhesive and / or the repair patch, which is typically comprised of a fiber reinforced, thermoset or a thermoplastic laminate. The curing assembly may also include a vacuum bag (not shown) that is used to compact the repair patch during the cure process.

[0028]The repair area 22 is located near a heat sensitive material (HSM) 24 which, in the illustrated example, comprises a structural stiffener 24a having a cap 26 which is bonded or otherwise fixed to the surface 20a of th...

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Abstract

An assembly of thermally conductive cooling blocks is configured to be placed against a composite skin between a heating blanket used to thermally cure a composite repair patch and a structure formed of a heat sensitive material. The cooling block assembly conducts heat away from the skin to prevent overheating of the heat sensitive material.

Description

BACKGROUND INFORMATION1. Field[0001]The present disclosure generally relates to systems and methods for cooling structures, and deals more particularly with an array of configurable cooling blocks for conducting heat away from a structure.2. Background[0002]It is sometimes necessary to protect heat sensitive structures against overheating. For example, in order to carry out an in-situ repair of a composite structure such as a composite aircraft skin, a heating blanket is used to thermally cure a composite repair patch placed on area of the skin requiring repair. In some cases, the skin repair area is located close to heat sensitive materials (HSM) such as an underlying peened titanium or aluminum stiffener.[0003]Depending on the difficulty of the application, shot bags that act as heat sinks, chilled air and / or fans can be used to cool the skin between the edge of the heating blanket and the HSM, in order to prevent overheating of the HSM. In other applications, however, the distanc...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B29C73/12F28F7/02B32B27/00B32B37/06B29C65/24
CPCB32B2309/02B32B2398/10B32B2605/18B29K2101/10B29K2105/253B29C73/12B29L2009/00B32B27/00B32B37/06B29C65/242B32B2305/77B29L2031/3076B29K2105/246F28F7/02B64F5/40B29C73/24B29C73/34B29C35/16
Inventor ZHU, ALEX X.CHARLES, DANIEL A.
Owner THE BOEING CO
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