Integrated electronic device with a redistribution region and a high resilience to mechanical stresses

Abstract

An integrated device includes a semiconductor body and a dielectric layer bounded by a surface. A conductive region of a first metal material forms a via region extending into a hole passing through the dielectric layer, and an overlaid redistribution region which extends over the surface. At least one barrier region of a second metal material extends into the hole and surrounds the via region, and the barrier region furthermore extending over the surface. A first coating layer of a third metal material covers the top and the sides of an upper portion of the redistribution region at a distance from the surface. A second coating layer of a fourth metal material extends at a distance from the surface and covers the first coating layer, and covers laterally a lower portion of the redistribution region which is disposed on top of portions of the barrier region extending over the surface.

Description

BACKGROUNDTechnical Field[0001]The present disclosure relates to an integrated electronic device, which includes a redistribution region and has a high resilience to mechanical stresses.Description of the Related Art[0002]As is known, in the field of technologies for fabricating semiconductor circuits, reference is generally made to the redistribution layer (RDL) in order to indicate an additional metal layer of an integrated circuit (“chip”) formed within a die, which allows the input / output pads (I / O) formed within the same die to be rendered electrically accessible. In other words, the redistribution layer is a metal layer connected to the I / O pads, to which the wires which allow the ‘wire bonding’ may, for example, be connected in different positions with respect to the positions in which the pads are disposed. The redistribution layer thus allows, for example, the processes of electrical connection between chips to be simplified.[0003]One example of use of the redistribution la...

AI Technical Summary

Benefits of technology

[0027]In light of the above, because of the different mechanical characteristics of the materials that form the redistribution layer 25, the first dielectric layer 11 and the first and second coating layers 30, 32, it is possible for the integrated electronic device 10 to be subjected to excessive mechanical stresses, which may compromise its operation. In particular, the stresses arise for example in the case in which the fabrication process includes the execution of steps with a high thermal budget.

Problems solved by technology

In particular, the stresses arise for example in the case in which the fabrication process includes the execution of steps with a high thermal budget.

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