Printed wiring board and display apparatus
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[0042]As shown in FIG. 8C, like the fabrication step in the first embodiment shown in FIG. 4A, through-holes 46 corresponding to the anode electrodes and cathode electrodes necessary for the simple matrix type EL display apparatus are formed in the glass substrate 41 by using a diamond drill 45. Upon formation of the through-holes 46, since at least the portions of the copper foils 44 located at the positions where the through-holes 46 are to be formed have been already removed as described above, particles of copper softer than glass do not clog spaces among fine particles of diamond of the diamond drill 45. This is effective to eliminate inconveniences caused by clogging of the diamond drill 45 with copper particles, and more specifically, prevent degradation of the drilling performance of the diamond drill 45, breakage of the diamond drill 45, and cracking of the glass substrate 41.
[0043]As shown in FIG. 9A, thin copper electroless plating and thick copper electroplating are sequ...
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