Gold-tin solder suitable for self-aligning applications

USH1934H1Inactive Publication Date: 2001-01-02AMERICAN TELEPHONE & TELEGRAPH CO
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
AMERICAN TELEPHONE & TELEGRAPH CO
Publication Date
2001-01-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

A tin-rich gold-tin solder is disclosed which is particularly advantageous for self-aligning applications. When utilized with gold-plated bond locations, the out-diffusion of tin from the solder during heating functions to shift the composition of the remaining solder closer to the eutectic value, thus preserving the liquid state of the solder and improving its reflow quality with respect to conventional eutectic solders.
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Description

BACKGROUND OF THE INVENTION1. Technical FieldThe present invention relates to a gold-tin solder and, more particularly, to a tin-rich, gold-tin solder.2. Description of the Prior ArtSoldering is a well-known technique for securing metal piece parts in a permanent fashion. Solder material must have the capacity to form metallurgical bonds with the two base metals that are to be joined. The bonding process results in the formation of an alloy in the surface of the base metal characterized by atoms of the soldering composition interspersed between atoms of the base metal.When the solder is heated to a molten state, it exists as a round droplet as a result of the attraction between the molecules forming the alloy. This attraction is commonly referred to as surface tension. For many technologically advanced applications, such as semiconductor and lightwave technologies, a solder composition of choice is a eutectic gold-tin material which is approximately 80% by weight gold and 20% by wei...

Claims

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