Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof

Abstract

A semiconductor device comprising a semiconductor pellet mounted on a pellet mounting area of the main surface of a base substrate, in which first electrode pads arranged on the back of the base substrate are electrically connected to bonding pads arranged on the main surface of the semiconductor pellet. The base substrate is formed of a rigid substrate, and its first electrode pads are electrically connected to the second electrode pads arranged on its reverse side. The semiconductor pellet is mounted on the pellet mounting area of the main surface of the base substrate, with its main surface downward, and its bonding pads are connected electrically with the second electrode pads of the base substrate through bonding wires passing through slits formed in the base substrate.

Description

[0001]This is a continuation of reissue application Ser. No. 09 / 613,541, filed Jul. 7, 2000, the subject matter of which is incorporated by reference herein.[0002]More than one reissue application has been filed for the reissue of U.S. Pat. No. 5,777,391. These reissue applications are: (1) Ser. No. 09 / 613,541, filed Jul. 7, 2000; (2) the present application, Ser. No. 10 / 105,236, filed Mar. 26, 2002; (3) Ser. No. 11 / 182,039, filed Jul. 15, 2005; (4) Ser. No. 11 / 182,040, filed Jul. 15, 2005; (5) Ser. No. 11 / 256,620, filed on Oct. 24, 2005; (6) Ser. No. 11 / 256,621 filed on Oct. 24, 2005; (7) Ser. No. 11 / 285,729, filed on Nov. 23, 2005; and (8) Ser. No. 11 / 285,730, filed on Nov. 23, 2005. [0003]The present reissue application also claims the benefit under 35 USC §120 of the filing date of Dec. 11, 1995 of Ser. No. 08 / 570,646, now U.S. Pat. No. 5,777,391, and benefit under 35 USC §119 of Japanese Application No. 6-316,444, filed on Dec. 20, 1994 and Japanese Application No. 7-126405, fi...

AI Technical Summary

Benefits of technology

"The patent text describes a semiconductor device with a BGA structure, which has a problem of increased size due to the increasing number of through-hole conductors and the need for a flexible substrate. The inventors have developed a technology to address these issues. The technology aims to reduce the size of the semiconductor device, increase its operating speed, enhance its electric reliability, improve mounting precision, and enhance the bonding force between the semiconductor pellet and the base substrate."

Problems solved by technology

Hence, there has been a problem that the external size of the base substrate 1 increase with the increasing number of the through-hole conductors 1C, which in turn increases the size of the semiconductor device as a whole.

There is also another problem which the inventors have considered.

This, in turn, increases inductance and reduces the operating speed of the semiconductor device.

This gives rise to an apprehension that the connection strength between the bonding wires and the second electrode pads may decrease, leading to connection failures of bonding wires and reduced electric reliability of the semiconductor device.

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