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Fast semiconductor heat-treating facility with vertical heat treating chamber

A rapid heat treatment, semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of large footprint and difficult to control the heating and cooling process of semiconductor wafers

Inactive Publication Date: 2007-12-19
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] There are two problems in the flat-laying semiconductor rapid heat treatment equipment: one is that it occupies a large area; the other is that the graphite heat treatment chamber has only one isothermal zone, which makes it difficult to control the heating and cooling process of the semiconductor wafer

Method used

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  • Fast semiconductor heat-treating facility with vertical heat treating chamber
  • Fast semiconductor heat-treating facility with vertical heat treating chamber
  • Fast semiconductor heat-treating facility with vertical heat treating chamber

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Embodiment Construction

[0075] Fig. 3 is a schematic diagram of a semiconductor rapid heat treatment equipment with a vertical heat treatment chamber according to the present invention. Fig. 4 is a schematic structural view of the vertical cylindrical heat treatment chamber in Fig. 3 . Fig. 5 is a schematic diagram of the cassette-to-cassette pick-and-place robot subsystem in Fig. 3 . Fig. 6 is a schematic diagram of a direct current flat graphite heater. Fig. 7 is a schematic diagram of a direct current cylindrical graphite heater.

[0076] The semiconductor rapid heat treatment equipment with vertical heat treatment chamber mainly includes: vertically arranged heat treatment chamber 1, wafer loading chamber 2, semiconductor wafer lifting mechanism 3; also includes a cassette-to-cassette three-folding arm robot subsystem 4 , Microcomputer control subsystem 5, temperature measurement and control subsystem 6, gas circuit device 7, heating power supply 19.

[0077] The heat treatment chamber mainly ...

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Abstract

This invention relates to semiconductor rapid thermal process device with vertical process chamber, which belongs to large-scale integration circuit technique field. It is characterized by the following: it comprises the vertical process chamber, loading chamber, semiconductor transistor lifting structure and also mechanic hand sub-system by case to case, micro machine control sub-system, temperature control sub-system, gas device and heating power. The thermal process chamber comprises vertical cylinder quartz heating chamber, top plate graphite heating device in chamber, and side cylinder graphite heating device.

Description

Technical field: [0001] Semiconductor rapid heat treatment equipment with a vertical heat treatment chamber belongs to the field of ultra-large-scale integrated circuit (ULSI) process technology, and is an indispensable key process equipment for the development and production of submicron and deep submicron ultra-large-scale integrated circuits. Background technique: [0002] In recent years, semiconductor technology has developed rapidly. The characteristic lines of ultra-large-scale integrated circuits (ULSI) have developed to the range of 0.25-0.13 μm, and the size of silicon wafers has increased from 6″ (150mm) to 8″ (200mm), 12″ (300mm ). With the continuous increase of silicon wafer size and the sharp reduction of characteristic lines, semiconductor rapid heat treatment technology has become an indispensable key process for the development and production of submicron and deep submicron VLSI, and the uniformity of heat treatment More stringent requirements have been put...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/324
Inventor 林惠旺陈必贤王舜远白玉琦
Owner TSINGHUA UNIV
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