Fast semiconductor heat-treating facility with vertical heat treating chamber

Abstract

This invention relates to semiconductor rapid thermal process device with vertical process chamber, which belongs to large-scale integration circuit technique field. It is characterized by the following: it comprises the vertical process chamber, loading chamber, semiconductor transistor lifting structure and also mechanic hand sub-system by case to case, micro machine control sub-system, temperature control sub-system, gas device and heating power. The thermal process chamber comprises vertical cylinder quartz heating chamber, top plate graphite heating device in chamber, and side cylinder graphite heating device.

Description

Technical field:

[0001] Semiconductor rapid heat treatment equipment with a vertical heat treatment chamber belongs to the field of ultra-large-scale integrated circuit (ULSI) process technology, and is an indispensable key process equipment for the development and production of submicron and deep submicron ultra-large-scale integrated circuits. Background technique:

[0002] In recent years, semiconductor technology has developed rapidly. The characteristic lines of ultra-large-scale integrated circuits (ULSI) have developed to the range of 0.25-0.13 μm, and the size of silicon wafers has increased from 6″ (150mm) to 8″ (200mm), 12″ (300mm ). With the continuous increase of silicon wafer size and the sharp reduction of characteristic lines, semiconductor rapid heat treatment technology has become an indispensable key process for the development and production of submicron and deep submicron VLSI, and the uniformity of heat treatment More stringent requirements have been put...

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