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Back board for through hole plugging device and assembling method

A device and backplane technology, which is applied in the field of electronic equipment, can solve the problems of poor reliability such as the inability to fix small gussets or small plug-in boards, and achieve the effects of engineering design difficulty and engineering cost, improved reliability, and convenient maintenance.

Inactive Publication Date: 2008-02-27
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a backplane and an assembly method for through-hole plug-in devices to solve the problem that the existing small pinch board or small plug-in board technology cannot be well realized on products with compact layout and dense slot spacing. Fixed poor reliability issues

Method used

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  • Back board for through hole plugging device and assembling method
  • Back board for through hole plugging device and assembling method
  • Back board for through hole plugging device and assembling method

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Embodiment Construction

[0037] In order to enable those skilled in the art to which the present invention belongs to understand the present invention more clearly, detailed descriptions will now be given in conjunction with the accompanying drawings.

[0038] FIG. 1 is a schematic diagram of a backplane with through-hole components of the present invention. The backplane with through-hole components includes: PCB 100 , crimp socket 110 and through-hole components 120 . Wherein, the crimping socket 110 is connected to the PCB 100 , and the through-hole device 120 is installed on the crimping socket 110 . The crimp-type pins of the crimp-type socket 110 are crimped in the aperture of the PCB 100 , and the crimp-type pins form an interference fit with the aperture. Through-hole plug-in devices can be discrete devices, such as plug-in resistors, capacitors, light-emitting diodes (LEDs) and other axially packaged devices, or single-in-line package devices (SIP) or dual-in-line packaged device (DIP), etc...

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Abstract

This invention disclosed a back-plate with through-hole plugging-in device. This back-plate contains PCB, crimp connection socket and through-hole plugging-in device. The PCB is connected with the crimp connection socket, and the crimp connection socket is connected with the through-hole plugging-in device. The crimp connection socket's induced plug is plugged into the cavity of the PCB hole, the coordination between them formed with stationary fit. This invention also disclosed an assembling method for through-hole plugging-in devices.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a backplane and an assembly method for devices inserted through holes. Background technique [0002] With the rapid development of communication technology, communication equipment is becoming more and more complex, and customers have higher requirements for the reliability of equipment. The backplane is installed at the bottom or middle of the subrack or the chassis, and is used for the interconnection of signals between boards or subcards and the carrier for supplying power to the boards or subcards. It plays a pivotal role in the entire device. The maintainability, repairability, and reliability requirements of the backplane are also increasing day by day. With the development of communication technology, the backplane must meet the requirements of transmitting high-speed signals, and high-speed signals often require the use of resistive capacitor devices for signal matchi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/32H05K1/18
Inventor 李文建张国栋王振华
Owner HUAWEI TECH CO LTD