Semiconductor packaging piece and its producing method

Abstract

Disclosed is a semiconductor package capable of realizing a smaller and more compact size and improving reliability of package product and a fabrication method thereof. The disclosed invention comprises; a main semiconductor chip operating as a lead frame or a substrate and having a plurality of main chip pads on the outer peripheral part thereof; one or more sub semiconductor chips adhered to a predetermined part of the main semiconductor chip and having a plurality of sub chip pads on the outer peripheral part thereof; an insulating layer formed on the main semiconductor chip in a shape surrounding the sub semiconductor chip to expose the main chip pads and the sub chip pads; a plurality of metal patterns electrically connecting the exposed main chip pad to the sub chip pad or one sub chip pad to another sub chip pad; and a plurality of solder lands formed on a predetermined part of the plurality of metal patterns.

Description

technical field [0001] The present invention relates to a semiconductor package, and more particularly, to a multi-chip type semiconductor package including a plurality of semiconductor chips and a method of manufacturing the same. Background technique [0002] In recent years, almost all electronic systems (such as computers, PCS, mobile phones, PDAs, etc.) using semiconductor chips (semiconductor elements) are increasingly becoming more functional and smaller and lighter in order to meet user needs. With the epoch-making development of design and manufacturing engineering technology that can respond to this trend, semiconductor chips and semiconductor packages used in electronic systems are also achieving higher functionality, smaller size and lighter weight. [0003] As well known, as semiconductor chip package technology, there are multi-chip module (MCM: multichip module) package, multi-chip package (MCP: multi chip package), and the like. [0004] Among the multi-chip...

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Problems solved by technology

[0007] However, the above-mentioned existing multi-chip module package and multi-chip package must adopt methods such as wire bonding, ribbon bonding, and flip-chip bonding to install on a base made of a thin film metal film, ceramics, or a substrate. Multiple semiconductor chips, or mount multiple semiconductor chips on a substrate by wire bonding, and use epoxy molding compound to embed the structure. There is a limit to small size and light weight

Moreover, since the existing package has a structure in which the pads of the semiconductor chip are connected to external leads using wires, etc., there is a problem of lowering the quality and reliability of the semiconductor package (that is, the problem of lowering the electrical characteristics).

In particular, the existing semiconductor package using EMC, the alpha particle source produced by the epoxy molding compound (EMC), makes the reliability of the semiconductor package significantly reduced, and there is contamination of the active area of ​​the device due to EMC , the problem of reduced package reliability

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