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Surface-mountable miniature light-emitting diode and/or photodiode and method for the production thereof

A technology of light-emitting diodes and photodiodes, which is applied in the direction of printed circuit manufacturing, electrical components assembly of printed circuits, circuits, etc., can solve the problem of reducing the height of components and achieve the effect of reducing the number

Inactive Publication Date: 2008-05-14
OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to continue to reduce the height of the components with the current shell scheme

Method used

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  • Surface-mountable miniature light-emitting diode and/or photodiode and method for the production thereof
  • Surface-mountable miniature light-emitting diode and/or photodiode and method for the production thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] figure 1 and 2 A surface-mountable miniature light-emitting diode generally indicated by 10 is schematically shown.

[0034] The micro light emitting diode 10 has a flexible lead frame 16 , an LED chip 22 with an active light-emitting site 38 and an encapsulation body 30 . The flexible lead frame 16 consists of a 60 μm thick metal film 12 and a likewise 60 μm thick epoxy resin film 14 , which are bonded to each other with high precision.

[0035] The stamping of the metal film 12 is such that it defines a cathode 18 and an anode 20, on which grooves 34 and 36 are punched out in the plastic film 14, respectively. The LED chip 22 is connected with its base 24 to the cathode 18 through the recess 34 . The anode 20 is connected to the upper side 26 of the LED chip 22 via the connection side 28 through the recess 36 .

[0036] In order to be able to realize as many components as possible on the flexible frame, so-called cavity-for-cavity encapsulation is used, for examp...

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PUM

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Abstract

A surface-mountable miniature luminescent diode with a chip package which has a leadframe ( 16 ) and a semiconductor chip ( 22 ) which is arranged on the leadframe ( 16 ) and is in electrical contact with it and which contains an active, radiation-emitting region. The leadframe ( 16 ) is formed by a flexible multi-layered sheet ( 12, 14 ).

Description

technical field [0001] The invention relates to a surface-mountable miniature light-emitting diode and / or photodiode, which has a chip housing with a lead frame (Leadframe) and a semiconductor chip arranged on the lead frame and in electrical contact with it, the chip Contains an active light emitting site. The invention also relates to a method of producing such a light-emitting diode. Background technique [0002] In order to increase the range of use and reduce the production costs, attempts are being made to produce light-emitting diodes and / or photodiodes of ever smaller structural dimensions. Very small light-emitting diodes are required, for example, for the backlighting of mobile phone keypads. [0003] LED (Light Emitting Diode) housings are currently available, which have an operating surface with dimensions 0402 (equivalent to 0.5 mm×1.0 mm) and a component height of 400 μm-600 μm. However, with current housing concepts it is difficult to further reduce the hei...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L31/02H01L23/495H01L31/0203H01L33/48H01L33/62H05K1/02H05K3/34
CPCH01L33/62H01L2224/48091H01L2224/48472H01L2224/73265H01L2224/48247H01L2924/12041H05K1/0203H01L31/0203H01L2224/48228H01L33/486H01L2224/48227H05K3/3442H01L2924/00014H01L2924/00
Inventor J·索尔格G·博纳G·维特尔R·布伦纳
Owner OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG