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Semiconductor device and manufacturing method of the same

A technology of semiconductors and supports, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as reduced reliability, and achieve improved reliability, low reliability suppression, and manufacturing processes simple effect

Inactive Publication Date: 2008-12-24
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, since such a protective layer is not provided, there is a problem in the semiconductor device that the reliability of electronic devices, not shown, etc. on the surface is lowered.

Method used

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  • Semiconductor device and manufacturing method of the same
  • Semiconductor device and manufacturing method of the same
  • Semiconductor device and manufacturing method of the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0057] Next, a semiconductor device according to a first embodiment of the present invention will be described with reference to the drawings. The manufacturing method of the semiconductor device of this embodiment is performed as follows. Figure 1 to Figure 6 It is a sectional view explaining the manufacturing method of the semiconductor device of this embodiment. in addition, Figure 7 is a cross-sectional view illustrating the semiconductor device and its manufacturing method of the present embodiment.

[0058] in addition, Figure 1 to Figure 7 A cross section of the semiconductor substrate 10 is shown at a predetermined boundary between adjacent chips (that is, near a not-shown dicing line) divided by a dicing step described later. in addition, Figure 1 to Figure 7 Among them, electronic devices (not shown) are formed on the surface of the semiconductor substrate 10 . Here, the unillustrated electronic device is, for example, a light-receiving element such as a CCD...

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PUM

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Abstract

A packaged semiconductor device and its manufacturing method improve reliability without extremely increasing manufacturing cost. A resin layer (12) and a support (13) are formed on the surface of a semiconductor substrate (10) on which a pad electrode (11) is formed. Next, an opening (15) penetrating the resin layer (12) and the support (13) is formed to expose the pad electrode (11). Then, a metal layer (16) is formed on the pad electrode (11) exposed by the opening (15), and a conductive terminal (17) is further formed. Finally, the semiconductor substrate (10) is divided into semiconductor chips (10c) by dicing. When this semiconductor device is mounted on a circuit substrate not shown, the conductive terminals (17) of the semiconductor chip (10c) are electrically connected to external electrodes of the circuit substrate not shown.

Description

technical field [0001] The present invention relates to a semiconductor device and a manufacturing method thereof, and particularly relates to a packaged semiconductor device and a manufacturing method thereof. Background technique [0002] In recent years, a CSP (Chip Size Package: chip size package) has attracted attention as a packaged semiconductor device. The CSP refers to a small package having an outer dimension substantially the same as that of a semiconductor chip. [0003] Currently, a BGA (Ball Grid Array: Ball Grid Array) type semiconductor device is known as one of CSPs. In this BGA type semiconductor device, a plurality of ball-shaped conductive terminals made of metal members such as solder are arranged in a grid pattern on one main surface of a package, and are electrically connected to a semiconductor chip mounted on the other surface of the package. [0004] Moreover, when this BGA type semiconductor device is incorporated into an electronic device, by pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48H01L21/60H01L21/78
CPCH01L24/32H01L2224/023H01L2224/05554H01L2224/24H01L2224/48091H01L2224/48227H01L2224/48465H01L2224/49175H01L2924/01005H01L2924/00014H01L2924/00H01L2924/00012H01L2924/0001
Inventor 野间崇
Owner SANYO ELECTRIC CO LTD