This invention belongs to the field of
wafer positioning technology, and mainly provides a positioning and correction mechanism for edge
etching equipment. It includes a split-type sealed cavity, a
processing platform, and a pneumatically operated lifting positioning component. The cavity consists of an upper and lower cavity that
interlock to form a sealed process chamber. The
processing platform is located in the center of the lower cavity and its
diameter is smaller than that of the
wafer, ensuring complete
exposure of the
wafer edge. The positioning component includes four
inverted T-shaped through holes arranged in a uniform ring around the circumference of the
processing platform, a matching
inverted T-shaped positioning element, a sealing cover, and an air source unit. The sealing cover at the lower end of the through holes communicates with the air source unit. The positioning element can rise and extend from the upper surface of the lower cavity under pneumatic drive, achieving secondary wafer positioning and correction. After positioning, it descends and retracts below the processing platform without interfering with the
etching process. This invention eliminates wafer misalignment caused by tolerance superposition, ensures centered wafer positioning, ensures uniform edge
etching, improves process stability and product yield, and features a simple structure, convenient maintenance, and strong versatility.