Process for the preparation of composite cubic boron nitride material
A technology of cubic boron nitride and composite materials, applied in metal material coating process, heating inorganic powder coating, coating, etc. Problems such as high product cost, achieve cost reduction, increase metallurgical bonding strength, and low manufacturing cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0019] Pure Cu, Ti and Sn metal powders with a particle size of 20-200 meshes are uniformly mixed according to the following proportions as alloy solder: Ti 5Wt%, Sn 6Wt%, Cu 89Wt%; then 70Wt% cubic boron nitride and The alloy solder of 30Wt% and the binding agent (polystyrene and three After the mixture of vinyl chloride) is fully mixed and uniform, it is coated on the surface of the steel substrate, and after being heated by vacuum brazing, a cubic boron nitride wear-resistant composite layer is formed on the surface of the substrate steel. The bonding strength between the composite layer and the matrix is 128Mpa.
Embodiment 2
[0021] The composition of alloy solder is: Ti 5Wt%, Sn 6Wt%, Cu 89Wt%; the mixing ratio of cubic boron nitride and alloy solder is: cubic boron nitride 30Wt%, alloy solder 70Wt%, plus 1Wt% Adhesive: The bonding strength between the cubic boron nitride composite layer and the matrix obtained in the same manner as in Example 1 is 147Mpa.
Embodiment 3
[0023] The composition of alloy solder is: Ti 5Wt%, Sn 6Wt%, Cu 89Wt%; the mixing ratio of cubic boron nitride and alloy solder is: cubic boron nitride 50Wt%, alloy solder 50Wt%, plus 5Wt% Adhesive: The bonding strength between the cubic boron nitride composite layer and the matrix obtained in the same way as in Example 1 is 131Mpa.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com