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Optical module with CAN package

An optical module and sealing material technology, applied in the field of optical modules, can solve the problems of unable to suppress parasitic inductance, unable to meet the miniaturization of optical module 101, unable to retain area, etc.

Inactive Publication Date: 2009-06-17
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The large outer diameter b causes the following problems: the miniaturization of the optical module 101 cannot be satisfied, the parasitic inductance cannot be suppressed, and a sufficient area cannot be reserved for mounting the chip part 106 on the front surface 131

Method used

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  • Optical module with CAN package
  • Optical module with CAN package
  • Optical module with CAN package

Examples

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Embodiment Construction

[0034] The invention will now be described herein with reference to exemplary embodiments. Those skilled in the art will appreciate that many alternative embodiments can be accomplished using the teachings of the present invention and that the invention is not limited to the exemplary embodiments described for explanatory purposes.

[0035] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0036] Figure 2A A side view of an optical transceiver 30 according to an embodiment of the invention is shown. The optical transceiver 30 includes an optical module 1 , a mounting board 5 and a flexible printed substrate 4 . The optical module 1 is a coaxial type, and is capable of high-speed transmission and / or reception of optical communication. The optical module 1 includes a stem portion 21, a cap 22 and a connector 23 connected to one end of an optical fiber cable. The rod portion 21 includes the rod 3 and the lead wi...

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Abstract

An optical module with a CAN package contains a stem and a lead. The stem has a hole penetrating the stem and an inner cylindrical surface surrounding the hole. The lead extends through the hole such that a gap exists between the lead and the inner cylindrical surface. The gap contains first and second portions which are arranged along the longitudinal direction of the hole. The first portion is filled with sealing material which is dielectric. The second portion is filled with air.

Description

technical field [0001] The present invention relates to an optical module for optical communication, and in particular to an optical module with CAN packaging. Background technique [0002] Optical transceivers for optical communications, such as 10 gigabit small form factor pluggable (XFP) optical transceivers, typically include optical modules in CAN packages. The optical module is a coaxial type, and allows high-speed transmission and / or reception of optical communication. Optical transceivers convert optical signals to electrical signals and / or convert electrical signals to optical signals. The CAN package is one of the basic packages with hermeticity, and is generally used as a package for a laser diode mounted in a compact disk drive (CDD). [0003] FIG. 1A shows a side view of an optical transceiver 100 as an example of an optical transceiver. The optical transceiver 100 has an optical module 101 , a mounting board 105 and a flexible printed substrate 104 . The op...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/36H04B10/14H04B10/02H01L31/02
CPCH01L2224/4823H01L23/49827H01L23/055H01L2924/3011H01L2224/48137G02B6/4201H01L24/48G02B6/4292G02B6/4246H01L2224/48235H01L23/66H01L2223/6622H01L2924/30107H01L2924/00014G02B6/4283G02B6/4281G02B6/4279H01L2224/45099H01L2224/45015H01L2924/207
Inventor 御田村和宏
Owner RENESAS ELECTRONICS CORP