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Chip for reducing ohm voltage drop and method thereof

A chip and chip packaging technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of increased chip area, increased number, increased power lines, etc., and achieve the effect of simple implementation, easy implementation, and reduced ohmic voltage drop

Inactive Publication Date: 2009-08-05
VIMICRO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantages of this solution are: firstly, the method of separately supplying power to IO and CORE causes additional overhead to the system, and secondly, in order to reduce the ohmic voltage drop and increase the power supply PAD, it is necessary to require pins (PIN) of the chip package. The number increases, so it is limited by the number of chip PINs
For a given design, the area of ​​the chip is fixed, so the length of the power line is also fixed; for increasing the width of the power line, this will increase the area of ​​the chip, resulting in an increase in cost, and it is not advisable

Method used

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  • Chip for reducing ohm voltage drop and method thereof
  • Chip for reducing ohm voltage drop and method thereof

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Embodiment Construction

[0024] The structural representation of an embodiment of the present invention is as figure 1 shown. In the figure, a square 100 with a side length a represents a bare chip (die), in which a VR110 is integrated. The input of VR is the IO voltage, and the output is the voltage required by the CORE. The dotted line inside the chip schematically shows the power supply network of the chip. The output of the VR is connected to the chip power supply network nearby to supply power for the chip CORE. In simplified models, it is often assumed that the ohmic voltage drop is proportional to the distance of VR from the chip device. Under the worst-case assumptions, the distance from the VR to the chip device can be as far as the diagonal of the square , about 1.4a.

[0025] In order to reduce the ohmic voltage drop, one of the schemes of the present invention adds four power supply PADs around the chip, that is, PADs A1-A4. These power supply PADs are arranged on the edge of a chip...

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Abstract

The invention relates to a chip for reducing ohmic voltage drop, comprising: a voltage modulator integrated inside the chip; at least one power supply pin arranged around the chip; the output of the voltage modulator is connected to the power supply pin, the The above power supply pins are connected to each other and connected to the power supply network of the chip. The invention also provides a corresponding method for reducing the ohmic voltage drop of the chip. The chip and the method thereof according to the invention can effectively reduce the ohmic voltage drop of the chip, and are simple and easy to implement.

Description

technical field [0001] The invention relates to a chip, especially a chip capable of reducing ohmic voltage drop and a method for reducing ohmic voltage drop. Background technique [0002] The power supply of the chip is the guarantee for the normal operation of the chip components. The power supply of the chip includes IO power supply and core (CORE) power supply. For the core power supply, due to the increasing integration of the chip, the number of logic gates on a chip is also increasing, the power supply line on the chip core is also getting longer and longer, and the voltage on the power line The pressure drop is also increasing. On the other hand, with the development of semiconductor technology, the value of the core voltage of the chip is getting lower and lower, which makes the range of the device's resistance to power supply voltage drop smaller and smaller, so that some devices that are too far away from the power supply may have insufficient power supply volta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/02H01L23/50
Inventor 刘健祝侃杨柱
Owner VIMICRO CORP