Module for optical device and manufacturing method thereof

Abstract

An electric wiring of a module for an optical apparatus includes: a first through electrode passing through the solid-state image sensor; a first rewiring layer being formed in such a way as to be re-wired to a necessary area in the rear surface of the solid-state image sensor, and being electrically connected to the first through electrode; a second rewiring layer being formed in such a way as to be re-wired to a necessary area in the rear surface of the image processing apparatus, and being electrically connected to the first rewiring layer; a second through electrode passing through the image processing apparatus and being electrically connected to the second rewiring layer; and a third rewiring layer being formed in such a way as to be re-wired to a necessary area in a front surface of the image processing apparatus, and being electrically connected to the second through electrode. The image processing apparatus includes an external connection terminal electrically connected to the third rewiring layer. With the foregoing structure, a small and light module for an optical apparatus and a production method of such module are realized without giving a constraint on the structure of the module.

Description

technical field [0001] The present invention relates to a module for an optical device including a solid-state imaging element and an image processing device for processing an electrical signal output from the solid-state imaging element, and a manufacturing method thereof. Background technique [0002] In recent years, modules for optical devices mounted on optical devices such as digital cameras and mobile phones with camera functions have been continuously developed (for example, Japanese Patent Application Laid-Open No. 2002-182270, publication date: June 2002 26). [0003] Next, as an example of a module for an optical device equipped with a CCD (Charge Coupled Device: Charge Coupled Device), a CMOS (Complementary Metal Oxide Semiconductor: Complementary Metal Oxide Semiconductor) imager, etc. in the prior art, an example of an optical device module, see Figure 7 The camera module 120 described in Japanese Patent Application Laid-Open No. 2002-182270 will be described....

AI Technical Summary

Problems solved by technology

[0021] However, in the module for an optical device described in Japanese Patent Application Laid-Open No. 2005-216970, even if the optical path delineator 212 and the wiring board 203 are bonded together via the adjustment part 214, the solid-state imaging element 201. The image processing device 202 and the light-transmitting cover part 210 are improperly sandwiched in the space surrounded by the optical path delimiter 212 and the wiring substrate 203

Therefore, there may be problems such as overall distortion or partial damage of the module for optical devices.

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