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Direct insertion type chip soldering seat and direct insertion type chip assembly structure

An in-line, chip technology, applied in the directions of printed circuit components, electrical components, printed circuits, etc., can solve problems such as short circuit of pad 96 and short circuit of pin 81 of DIP chip 80

Inactive Publication Date: 2009-09-23
FOSHAN PREMIER SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the pads 96 of the via holes 92 in the same column are distributed on the same straight line, the pitch between the pads (Pitch) is very small. When the DIP chip 80 is soldered, it is easy to cause a short circuit between the pads 96, resulting in a short circuit of the pins 81 of the DIP chip 80.

Method used

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  • Direct insertion type chip soldering seat and direct insertion type chip assembly structure
  • Direct insertion type chip soldering seat and direct insertion type chip assembly structure
  • Direct insertion type chip soldering seat and direct insertion type chip assembly structure

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0019] Please also see figure 1 and Figure 4 , the in-line chip socket 10 of this embodiment is used to assemble the SIP chip 70, and the in-line chip socket 10 includes a substrate 12 with a welding surface 11, an insertion portion 13 opened on the welding surface 11 and a pad group 14 formed on the soldering surface 11 . The inserting portion 13 is used for accommodating a row of pins 71 of the SIP chip 70 , and the pad set 14 is used for soldering the row of pins 71 of the SIP chip 70 . The pad group 14 includes a plurality of pads 15 distributed on the edge of the insertion portion 13, and the two pads 15 for welding the two adjacent pins 71 of the SIP chip 70 are respectively located on the edges of the insertion portion 13. sides.

[0020] The substrate 12 of this embodiment is an in-line chip soldering portion of a printed circuit board 16 (Printed Circuit Board, PCB), and the soldering surface 11 is the electronic component assembly surface of the printed circuit b...

no. 2 example

[0027] see Figure 6 The differences between the in-line die soldering holder 20 of this embodiment and the in-line die soldering holder 10 of the first embodiment include:

[0028] The insertion portion 23 in this embodiment is a strip-shaped slot for accommodating a row of pins 71 of the SIP chip 70 . Specifically, the strip-shaped slot is a rectangular slot, its width is slightly greater than the thickness of the pins 71 of the SIP chip 70, and its length is slightly greater than the width of a column of pins 71 of the DIP chip 70, so that a column of the DIP chip 70 The pins 71 can be securely inserted into the slots.

no. 3 example

[0030] see Figure 7 , the difference between the in-line die solder holder 30 of this embodiment and the in-line die solder holder 20 of the second embodiment is:

[0031] Please combine figure 2 , the in-line chip holder 30 of this embodiment is used to assemble the DIP chip 80 . Corresponding to the two rows of parallel pins 81 of the DIP chip 80, the in-line chip soldering seat 30 includes two parallel elongated slots and two pad groups 14 to accommodate and weld the two rows of parallel DIP chips 80. of pin 81.

[0032] The parts of the substrate 12 corresponding to the pads 15 of the two pad groups 14 protrude inwardly into the corresponding elongated slots. In this way, the two rows of pins 81 of the DIP chip 80 are inserted behind the two strip-shaped slots, and each pin 81 is closely attached to the corresponding pad 15, which is convenient for soldering operations, and can ensure that the pins 81 and the pads 15 have Good electrical contact.

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PUM

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Abstract

The invention provides a direct-inserting-typed chip welding seat which comprises a substrate with a welding surface, at least one intercalation part arranged on the welding surface and at least one bonding pad group formed on the welding surface. Each intercalation part is used for holding one row of the base pins of a direct-inserting-typed chip to be assembled; and each bonding pad group comprises a plurality of bonding pads positioned on the edge of the corresponding intercalation part and used for welding the row of the base pins of the direct-inserting-typed chip to be assembled. In the same bonding pad group, two bonding pads that are used for welding the two adjacent base pins of the direct-inserting-typed chip to be assembled are respectively positioned at the two sides of the corresponding intercalation part. Two bonding pads of the direct-inserting-typed chip welding seat, that are used for welding the two adjacent base pins of the direct-inserting-typed chip to be assembled, are distributed at two sides of the corresponding intercalation part, therefore, the space between bonding pads can be enlarged and the short circuit of the base pins caused by the phenomenon of end connection when the bonding pads weld the base pins is avoided. In addition, the invention also provides a direct-inserting-typed chip assembly structure that adopts the direct-inserting-typed chip welding seat.

Description

technical field [0001] The invention relates to printed circuit board technology, in particular to an in-line chip soldering seat and an in-line chip assembly structure with the in-line chip soldering seat. Background technique [0002] The in-line chip mainly includes a SIP chip in a single in-line package (SIP) and a DIP chip in a dual in-line package (DIP). see figure 1 and figure 2 , are three-dimensional schematic diagrams of a SIP chip and a DIP chip, respectively. The SIP chip 70 has one column of pins 71 and the DIP chip 80 has two columns of pins 81 . The following takes the DIP chip soldering socket as an example to illustrate the structure of the traditional in-line chip soldering socket. [0003] see image 3 , the conventional DIP chip pad 90 includes a substrate 91 and two rows of via holes 92 . The substrate 91 is a DIP chip assembly portion of a printed circuit board 93 , which includes a soldering surface 94 . Each row of via holes 92 corresponds to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H01R12/00
CPCH05K2201/09463H05K3/3447H05K1/116H05K2201/10696H01R43/0256H05K2201/09709H05K2201/10689
Inventor 侯震王境良
Owner FOSHAN PREMIER SCI & TECH CO LTD