Printed wiring board

A technology of printed circuit boards and conductor circuits, which is applied in the manufacture of printed circuit components and multilayer circuits, and can solve problems such as IC malfunctions
CN100556228CActive Publication Date: 2009-10-28IBIDEN CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
IBIDEN CO LTD
Publication Date
2009-10-28

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Abstract

The present invention provides a printed circuit board, which is formed by alternately stacking insulating layers and conductor circuits, each conductor circuit has a rectangular cross-section, wherein the upper side interval of the conductor circuit among the intervals between adjacent conductor circuits is set to W1, When the interval on the lower surface side of the conductor circuit is W2, the relationship between these intervals and the thickness T of the conductor circuit satisfies 0.10T≦|W1-W2|≦0.73T. According to such a configuration, even if an IC driven at high speed is mounted, crosstalk and signal delay can be suppressed, and malfunction of the IC can be prevented.
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Description

technical field

[0001] The present invention relates to a printed circuit board having a fine wiring structure that does not cause malfunction due to crosstalk, signal transmission delay, etc. even if a high-speed drive IC is mounted thereon. Background technique

[0002] A laminated printed wiring board is an example of a printed wiring board formed by filling insulating material between conductive circuits. In such a printed wiring board, for example, conductive circuits and interlayer resin insulating layers are alternately laminated on a core substrate, and the conductive circuits on the lower layer and the conductive circuits on the upper layer are electrically connected through so-called via holes. The via hole is formed by opening an interlayer resin insulating layer and providing a plated film on the opening (see Japanese Laid-Open Patent Publication No. 11-176985 or Japanese Laid-Open Patent Publication No. 11-243279).

[0003] In such a printed circuit board, inte...

Claims

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