Printed wiring board

Abstract

The present invention provides a printed circuit board, which is formed by alternately stacking insulating layers and conductor circuits, each conductor circuit has a rectangular cross-section, wherein the upper side interval of the conductor circuit among the intervals between adjacent conductor circuits is set to W1, When the interval on the lower surface side of the conductor circuit is W2, the relationship between these intervals and the thickness T of the conductor circuit satisfies 0.10T≦|W1-W2|≦0.73T. According to such a configuration, even if an IC driven at high speed is mounted, crosstalk and signal delay can be suppressed, and malfunction of the IC can be prevented.

Description

technical field

[0001] The present invention relates to a printed circuit board having a fine wiring structure that does not cause malfunction due to crosstalk, signal transmission delay, etc. even if a high-speed drive IC is mounted thereon. Background technique

[0002] A laminated printed wiring board is an example of a printed wiring board formed by filling insulating material between conductive circuits. In such a printed wiring board, for example, conductive circuits and interlayer resin insulating layers are alternately laminated on a core substrate, and the conductive circuits on the lower layer and the conductive circuits on the upper layer are electrically connected through so-called via holes. The via hole is formed by opening an interlayer resin insulating layer and providing a plated film on the opening (see Japanese Laid-Open Patent Publication No. 11-176985 or Japanese Laid-Open Patent Publication No. 11-243279).

[0003] In such a printed circuit board, inte...

Examples

Embodiment 1

[0042] (A) Preparation of kneaded product containing scaly particles

[0043] To a mixed solvent of 20 g of methyl ethyl ketone (hereinafter referred to as "MEK") and 80 g of xylene was added 15 g of scaly particles (manufactured by Hojun Co., Ltd., trade name "Esben C"), and the aspect ratio at the time of dispersion : ~500, crystal size: ~0.5μm), and kneaded with three rollers to make a kneaded product containing scaly particles.

[0044] (B) Preparation of solution containing epoxy resin

[0045] To a mixed solvent of 6.8 g M EK and 27.2 g of xylene, 85 g of solid epoxy resin (manufactured by Japan EPOXY RESIN, trade name "Epicoat 1007") was added and mixed to form a ring-containing solution of oxygen resin.

[0046] (C) Preparation of resin film for interlayer insulating layer

[0047] The kneaded product containing the scaly particles produced in the above (A), the solution containing the epoxy resin produced in the above (B), and dicyandiamide (bii·tei· Ai Japan (BTA...

Embodiment 2

[0162] Change the mask for pattern formation of the plating resist layer, and change the electrolytic copper plating conditions and the thickness of the conductive circuit after film thickness adjustment so that the L / S of the signal line is 7.5 μm / 7.5 μm, and the thickness T of the conductive circuit is 7.5 μm, except Other than that, a multilayer printed wiring board was produced in the same manner as in Example 1.

[0163] In this embodiment, the value of |W1-W2| is 0.675 μm to 2.775 μm, which basically satisfies the relationship of (0.10×thickness T of the conductive circuit) to (0.35×thickness T of the conductive circuit). Also, the standard deviation σ of |W1-W2| was 1.33 μm.

Embodiment 3

[0165] Change the mask for pattern formation of the plating resist layer, and change the electrolytic copper plating conditions and the thickness of the conductive circuit after film thickness adjustment so that the L / S of the signal line is 10.0 μm / 10.0 μm, and the thickness T of the conductive circuit is 10.0 μm, except Other than that, a multilayer printed wiring board was produced in the same manner as in Example 1.

[0166] In this embodiment, the value of |W1-W2| is 0.9 μm to 3.6 μm, which basically satisfies the relationship of (0.10×thickness T of the conductive circuit) to (0.35×thickness T of the conductive circuit). Also, the standard deviation σ of |W1-W2| was 1.27 μm.

technical field

[0001] The present invention relates to a printed circuit board having a fine wiring structure that does not cause malfunction due to crosstalk, signal transmission delay, etc. even if a high-speed drive IC is mounted thereon. Background technique

[0002] A laminated printed wiring board is an example of a printed wiring board formed by filling insulating material between conductive circuits. In such a printed wiring board, for example, conductive circuits and interlayer resin insulating layers are alternately laminated on a core substrate, and the conductive circuits on the lower layer and the conductive circuits on the upper layer are electrically connected through so-called via holes. The via hole is formed by opening an interlayer resin insulating layer and providing a plated film on the opening (see Japanese Laid-Open Patent Publication No. 11-176985 or Japanese Laid-Open Patent Publication No. 11-243279).

[0003] In such a printed circuit board, inte...

Examples

Embodiment 1

[0042] (A) Preparation of kneaded product containing scaly particles

[0043] To a mixed solvent of 20 g of methyl ethyl ketone (hereinafter referred to as "MEK") and 80 g of xylene was added 15 g of scaly particles (manufactured by Hojun Co., Ltd., trade name "Esben C"), and the aspect ratio at the time of dispersion : ~500, crystal size: ~0.5μm), and kneaded with three rollers to make a kneaded product containing scaly particles.

[0044] (B) Preparation of solution containing epoxy resin

[0045] To a mixed solvent of 6.8 g M EK and 27.2 g of xylene, 85 g of solid epoxy resin (manufactured by Japan EPOXY RESIN, trade name "Epicoat 1007") was added and mixed to form a ring-containing solution of oxygen resin.

[0046] (C) Preparation of resin film for interlayer insulating layer

[0047] The kneaded product containing the scaly particles produced in the above (A), the solution containing the epoxy resin produced in the above (B), and dicyandiamide (bii·tei· Ai Japan (BTA...

Embodiment 2

[0162] Change the mask for pattern formation of the plating resist layer, and change the electrolytic copper plating conditions and the thickness of the conductive circuit after film thickness adjustment so that the L / S of the signal line is 7.5 μm / 7.5 μm, and the thickness T of the conductive circuit is 7.5 μm, except Other than that, a multilayer printed wiring board was produced in the same manner as in Example 1.

[0163] In this embodiment, the value of |W1-W2| is 0.675 μm to 2.775 μm, which basically satisfies the relationship of (0.10×thickness T of the conductive circuit) to (0.35×thickness T of the conductive circuit). Also, the standard deviation σ of |W1-W2| was 1.33 μm.

Embodiment 3

[0165] Change the mask for pattern formation of the plating resist layer, and change the electrolytic copper plating conditions and the thickness of the conductive circuit after film thickness adjustment so that the L / S of the signal line is 10.0 μm / 10.0 μm, and the thickness T of the conductive circuit is 10.0 μm, except Other than that, a multilayer printed wiring board was produced in the same manner as in Example 1.

[0166] In this embodiment, the value of |W1-W2| is 0.9 μm to 3.6 μm, which basically satisfies the relationship of (0.10×thickness T of the conductive circuit) to (0.35×thickness T of the conductive circuit). Also, the standard deviation σ of |W1-W2| was 1.27 μm.

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