Electroplating method
A technology of electroplating equipment and electrodes, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc. It can solve the problems of electroplating solution aging and inability to solve many particle defects on the surface of the wafer, so as to increase humidity, reduce electrolyte volume, The effect of increasing the range
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[0049] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0050] The processing method of the present invention can be widely used in each field, is described below by specific embodiment, certainly the present invention is not limited to this specific embodiment, the general knowledge well known to those of ordinary skill in the art Substitutions are undoubtedly within the scope of the present invention.
[0051] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the schematic diagrams showing the structure of the equipment will not be partially enlarged according to the general scale, which should not be used as a limitation of the present invention. In additi...
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