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A sawing device and a control method for manufacturing processes of semiconductor package

A cutting device and semiconductor technology, applied in semiconductor/solid-state device manufacturing, fine working devices, manufacturing tools, etc.

Active Publication Date: 2007-08-01
HANMI SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] Therefore, the present invention aims to solve the problems described above, and an object of the present invention is to provide a cutting device and a cutting device capable of improving the productivity of semiconductor packages by simultaneously performing unloading work of semiconductor packages and loading work of strips during the cutting process. its control method

Method used

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  • A sawing device and a control method for manufacturing processes of semiconductor package
  • A sawing device and a control method for manufacturing processes of semiconductor package
  • A sawing device and a control method for manufacturing processes of semiconductor package

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Embodiment Construction

[0037] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

[0038] 3 is a plan view showing a cutting device for manufacturing a semiconductor package according to a first embodiment of the present invention, and FIG. 4 is a perspective view showing a chuck table and a chuck shown in FIG. 3 , and FIG. Plan view of the strip / package pick-up section.

[0039] As shown in FIGS. 3 to 5, the cutting device according to the present invention includes a chuck table 23 and two chucks 233a and 233b, and the chuck table 23 is installed on the chuck table base 200 so that the chuck table can Moving horizontally in the X-axis direction on the chuck table base 200, two chucks 233a and 233b are rotatably mounted on the chuck table 23 so that strips S are alternately loaded on the chucks 233a and 233b.

[0040] As shown in FIG. 4 , the chuck table 23 includes a base 231 and a servo motor 232 disposed on the upper surface of the base 23...

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Abstract

Disclosed is a sawing apparatus for manufacturing a semiconductor package, capable of simultaneously performing strip loading work and package unloading work during the sawing process to improve productivity of the semiconductor packages. The sawing apparatus includes a chuck table base 200; a chuck table 23 installed on the chuck table base 200 such that the chuck table 23 horizontally moves on the chuck table base 200; two chuck plates 233a and 233b rotatably installed on the chuck table 23 such that a strip S is loaded on upper surfaces of the chuck plates 233a and 233b by turns; a sawing machine 30 for dividing the strip S loaded on the chuck plate into individual packages P by performing a relative movement with respect to the chuck table 23; and a strip / package picker 22 for loading the strip S onto the chuck plates and unloading the packages P from the chuck plates, simultaneously.

Description

technical field [0001] The present invention relates to a cutting device for manufacturing semiconductor packages and a control method thereof. In particular, the present invention relates to a dicing device and a control method thereof capable of improving productivity of semiconductor packages by improving the structure of a chuck table and a dicing process. Background technique [0002] In general, semiconductor packages are obtained through various manufacturing processes of forming a semiconductor chip with a high integrated circuit such as transistors and capacitors on a silicon semiconductor substrate, attaching the silicon semiconductor substrate to a lead frame or a printed circuit board, using a wire The semiconductor chip is electrically connected to a lead frame or a printed circuit board, and EMC (epoxy molding compound) is molded onto the semiconductor chip, so that the semiconductor chip is protected from the external environment. [0003] Such semiconductor ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78
CPCB28D5/023B28D5/0082B28D5/024
Inventor 李龙构
Owner HANMI SEMICON CO LTD